文献类型：期刊文献

英文题名：Synthesis and application of anthraquinone quaternary phosphonium salt electroplating copper leveler based on expanded electrostatic adsorption area strategy and physicochemical salt bridge mechanism

作者：Li, Xuyang[1];Chen, Xin[1];Zou, Peikun[1];Ye, Renkui[1];Wang, Limin[1]

机构：[1]East China Univ Sci & Technol, Inst Fine Chem, Sch Chem & Mol Engn, Shanghai Key Lab Funct Mat Chem, 130 Meilong Rd, Shanghai 200237, Peoples R China

年份：2024

卷号：664

外文期刊名：APPLIED SURFACE SCIENCE

收录：;EI(收录号：20242016089648);WOS:【SCI-EXPANDED(收录号:WOS:001242459000001)】；

基金：This research was financially supported by the National Natural Science Foundation of China (21772039, 21272069) and Sinopec Seeding Program (ZC0607-0869) , and we gratefully acknowledge financial support from the Central Universities and Key Laboratory of Organofluorine Chemistry, Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences. Support from the Chinese Scholarship Council is also acknowledged.

语种：英文

外文关键词：Anthraquinone; Electrochemistry; Leveler; Copper electrodeposition

摘要：Four anthraquinone quaternary phosphate molecules (AQS-a, AQS-b, AQS-c, AQS-d) with different electrostatic adsorption areas were constructed as electroplating levelers based on the strategy of expanding the electrostatic adsorption area of the molecules. AQS-d with the largest electrostatic adsorption area was demonstrated to have the most excellent electrochemical performance by electrochemical tests. The physicochemical adsorption sites and interactions with copper ions of AQS levelers were proposed by theoretical calculations, molecular dynamics simulations, Raman spectroscopy and fluorescence absorption spectroscopy, and the electroplating salt bridge mechanism was proposed. Based on optical microscope, scanning electron microscope, atomic force microscope and X-ray diffractometer, it is proved that AQS-d has the ability to perfectly fill the microvia in actual plating by actual PCB blind hole filling experiment.