文献类型：期刊文献

英文题名：Highly Enhanced Thermal Conductivity of Tpu Composites with Segregated Network Constructed by the In-Situ Reduction of Copper

作者：Wang, Yi[1]; Chen, Qiming[1]; Liu, Chao[1]; Li, Shuo[1]; Wu, Wei[1]

机构：[1] Sino-German Joint Research Center of Advanced Materials, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai, 200237, China

年份：2022

外文期刊名：SSRN

收录：EI(收录号：20220069103)

语种：英文

外文关键词：Blending - Chemical bonds - Composite materials - Copper - Granulation - Heat conduction - Shells (structures) - Thermal conductivity - Thermogravimetric analysis - X ray photoelectron spectroscopy

摘要：Cu@TPU composite particles with a structure of TPU core and Cu particles shell were fabricated by in-suite reduction of Cu on the surface of TPU granules. The Cu@TPU composites were then prepared by the hot compression of the as-prepared core-shell particles. The Cu@TPU composite granules were characterized by X-ray photoelectron spectroscopy, X-ray diffraction, thermogravimetric analysis and scanning electron microscopy, which verified that the outer layer of core-shell structure was Cu particles and the connection between Cu and TPU was chemical bonding. The cross-section of Cu@TPU composites showed typical pattern of segregated structure and the surface of those were covered by a layer of Cu. With the stacking effect of the special location of Cu and the chemical connection between Cu and TPU, the Cu@TPU composites exhibited a high thermal conductivity of 3.2146W/mK at 23vol% filler loading, which was 2.6 times to that of Cu/TPU composites fabricated through simple blending. The TC data of the composites were correlated with Foygel’s model. In addition, the dielectric properties and electrical conductivity of the composites were measured. ? 2022, The Authors. All rights reserved.