文献类型：期刊文献

英文题名：Design of novel silicon-containing alkynyl diamines and their related thermosetting polyimide resins

作者：Liu, Yumeng[1];Liu, Xiwei[1];Xia, Jiyu[1];Wang, Yitian[1];Hu, Jianke[1];Hu, Yanhong[1]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Key Lab Specially Funct Polymer Mat & Related Tech, Minist Educ, 130 Meilong Rd, Shanghai 200237, Peoples R China

年份：2024

卷号：36

期号：6-7

起止页码：347

外文期刊名：HIGH PERFORMANCE POLYMERS

收录：;EI(收录号：20243116787258);WOS:【SCI-EXPANDED(收录号:WOS:001276823200001)】；

基金：The author(s) disclosed receipt of the following financial support for the research, authorship, and/or publication of this article: This work was supported by "the Fundamental Research Funds for the Central Universities," JKD01241701.

语种：英文

外文关键词：Polyimide; silicon; alkynyl; thermal stability; processability

摘要：In order to improve the PI resin's processability and thermal properties, a novel diamine monomer bis(p-aminophenylethynyl)dimethylsilane was designed and synthesized by introducing silicon and alkyne groups in this paper. And a new thermosetting polyimide resin SiOPI with silicon and alkynyl structures in the main chain was prepared using 4,4 '-oxobis (phthalic anhydride) (ODPA) as the dianhydride monomer with this diamine monomer. The structures of the diamine monomer and the polyimide were characterized by H nuclear magnetic resonance spectroscopy (1H NMR), Fourier transform infrared spectroscopy (FT-IR), mass spectrometry (MS), and X-ray diffraction (XRD), respectively. The incorporation of silyl groups into the PI increases the flexibility of the resin and provides good solubility and processability. The SiOPI is well soluble in DMF, DMSO and THF. The resin has a viscosity of less than 200 Pas at 50-88 degrees C and has a wide processability range. By virtue of the introduction of alkyne groups, the cured polyimide forms dense reticulated structures, analogous to the benzene ring, giving the resin excellent heat resistance and mechanical property. The glass transition temperature (Tg) of SiOPI reached 367 degrees C, and the heat loss temperature at 5% (Td5) is 540.9 degrees C, the heat loss temperature at 10% (Td10) is 592.2 degrees C, and the residual carbon rate at 800 degrees C (R800 degrees C) is 65.76% in a nitrogen atmosphere. The tensile strength of c-SiOPI is 257.6 MPa at room temperature and 232.9 MPa with a retention rate of 90.41% at 300 degrees C, respectively.