文献类型：期刊文献

中文题名：甲基磺酸盐电镀锡工艺参数对镀层结合力影响

英文题名：Effects of Process Parameters on Coating Cohesion in Tin Electroplating with Methanesulfonate

作者：阴子良[1];叶东东[1];陈广[1];陈建钧[1]

机构：[1]华东理工大学机械与动力工程学院,上海200237

年份：2015

卷号：36

期号：12

起止页码：1124

中文期刊名：腐蚀与防护

外文期刊名：Corrosion & Protection

收录：CSTPCD;;Scopus;北大核心:【北大核心2014】；

基金：国家自然科学基金(51105143;51375164)

语种：中文

中文关键词：电镀锡;甲基磺酸盐;镀层结合力

外文关键词：tin electroplating; methanesulfonate; coating cohesion;

摘要：通过正交试验和极差分析研究了各工艺参数对镀层与基体间的结合力影响程度,通过单因素试验研究了各工艺参数对结合力的影响规律,并获得了最佳工艺参数。结果表明,最佳工艺参数为阴极电流密度3A/dm2,甲基磺酸体积浓度45mL/L,添加剂体积浓度45mL/L,Sn2+质量浓度15g/L,电镀温度35℃。
The extents of different parameters′impact on cohesion between coating and substrate were examined by orthogonal experiments and range analysis.The relationship between each parameter and cohesion was studied by single factor experiments and the optimum technological parameters were obtained.The results show that the optimum technological parameters were as follows：cathodic current density 3 A/dm^2,bulk concentration of methanesulfonate 45 mL/L,bulk concentration of additive 45 mL/L,mass concentration of Sn^2＋15 g/L and electroplating temperature 35 ℃.