文献类型：期刊文献

英文题名：Thermal Stress in Multilayered Flexible Solar Cell Circuit With Different Temperatures

作者：Shi, Chunhao[1];Huang, Zhichao[1];Yu, Tianhao[1];Gao, Yang[1,2];Wu, Min[3];Qian, Min[4];Zhang, Enjie[5];Yan, Yabin[1,2]

机构：[1]East China Univ Sci & Technol, Shanghai Key Lab Intelligent Sensing & Detect Tech, Shanghai, Peoples R China;[2]East China Univ Sci & Technol, Sch Mech & Power Engn, Key Lab Pressure Syst & Safety, Minist Educ, Shanghai, Peoples R China;[3]Shanghai Inst Space Power Sources, State Key Lab Space Power Sources, Shanghai, Peoples R China;[4]East China Univ Sci & Technol, Sch Phys, Shanghai, Peoples R China;[5]Shanghai Inst Aerosp Syst Engn, Natl Key Lab Aerosp Mech, Shanghai, Peoples R China

年份：2026

卷号：8

期号：4

外文期刊名：ENGINEERING REPORTS

收录：EI(收录号：20261520497269);WOS:【ESCI(收录号:WOS:001751778200039)】；

基金：This work was supported by the Space Application System of China Manned Program; National Natural Science Foundation of China (52275149, 52275146, 12411530109); Opening Project of State Key Laboratory of Space-Power (YF07050124F1266).

语种：英文

外文关键词：finite element simulations; stress distribution; temperature dependence; thermo-mechanical response; thin-film GaAs solar-cell

摘要：Under space-relevant wide-temperature conditions, multilayer flexible thin-film GaAs solar-cell circuit assemblies can develop warpage and thermal stresses due to thermo-mechanical mismatch among constituent materials. This study combines temperature-dependent experimental characterization with finite element simulations to investigate the assembly-level thermo-mechanical response. Tensile tests and stress-relaxation experiments were conducted at different temperatures to obtain elastic properties of key materials and the viscoelastic response of polyimide (PI) films, and these data were used to build a thermo-mechanically coupled finite element model of the multilayer circuit structure. The simulations show a temperature-dependent change in warpage direction. Intra-layer thermal stresses redistribute with temperature, where the copper layer exhibits the highest stress level at low temperatures and the cell layer exhibits the highest stress level at high temperatures. This stress-bearing shift is associated with the temperature dependence of material properties and constraint-controlled load sharing, and is also influenced by the discontinuous load path introduced by the discrete cell-array geometry. In addition, peeling- and shear-related indicators were extracted and compared along critical interfaces as a screening-level assessment of interfacial damage under thermal loading. The results provide theoretical support to the analysis of temperature-dependent stress evolution and reliability assessment under wide-temperature thermal loading.