文献类型：期刊文献

英文题名：Cyanate ester composites containing surface functionalized BN particles with grafted hyperpolyarylamide exhibiting desirable thermal conductivities and a low dielectric constant

作者：Zhang, Xiuyun[1];Wang, Fan[1];Zhu, Yaping[1];Qi, Huimin[1]

机构：[1]East China Univ Sci & Technol, Key Lab Specially Funct Polymer Mat & Related Tec, Minist Educ, Sch Mat Sci & Engn, Shanghai 200237, Peoples R China

年份：2019

卷号：9

期号：62

起止页码：36424

外文期刊名：RSC ADVANCES

收录：;EI(收录号：20194707706998);WOS:【SCI-EXPANDED(收录号:WOS:000497825500060)】；

基金：This work is supported by Key Laboratory of Specially Functional Polymeric Materials and Related Technology of Ministry of Education, East China University of Science & Technology, and supported by the Fundamental Research Funds for the Central Universities (50321041918013, 50321041917001).

语种：英文

外文关键词：Grafting (chemical) - Glass transition - Esters - Printed circuit boards

摘要：Surface functionalized BN particles with grafted hyperbranched polyarylamide (BN-HBP) were prepared and used to improve the thermal conductivity and low dielectric constant of BN-filled cyanate ester resin (BN-HBP/CE) composites. The thermal stability, dielectric properties, thermal conductivity and dynamic mechanical properties of the BN-HBP/CE composites were investigated. The results illustrate that BN-HBP/CE composites with a load of 32 wt% exhibit a high glass transition temperature of 283 degrees C, low dielectric constant of 3.29 at 1 MHz, and a desirable thermal conductivity of 0.97 W/(m center dot K). Additionally, these novel materials exhibit a high decomposition temperature of 5% weight loss at 407 degrees C and low curing shrinkage of -0.64%. When the loading is 38 wt%, the thermal conductivity of BN-HBP/CE composites is 1.27 W/(m center dot K). These findings have significant implications for the preparation of high-performance substrates that meet the requirements for application as printed circuit board substrates.