文献类型：专利

英文题名：Silicon di:oxide based polishing agent - consists of silica powder, water, dispersing stabiliser, moisture regulator, pH regulator and surface treating agent

作者：WANG X;LIU W;LIU B

机构：[1]UNIV EAST CHINA SCI & TECHNOLOGY

申请号：CN1063205-C

公开日：2001-03-14

语种：英文

收录：DERWENT

摘要：The polishing agent consists of SiO2 powder, water, dispersing stabilizer, moisture regulator, pH regulator and surface treating agent. It has SiO2 content of 60 wt%, viscosity less than 0. 1 Pa.s, and gravitational setting over 1 year. USE - Used in polishing silicon chip and processing IC, especially suitable for plane processing of multilayer film of large scale ICs, and in finish CMP treatment of wafer and other semiconductor device processing course as well as the processing course of plane display, polycrystalline module, miniature motor system and opto-conductive image tube, etc. ADVANTAGE - High polishing quality and speed are provided.