文献类型：期刊文献

中文题名：一种含硅芳炔树脂泡沫的制备及性能

英文题名：Preparation and Properties of Silicon-Containing Arylacetylene Resin Foam

作者：魏杨[1];邓诗峰[1];李登同[1];杜磊[1]

机构：[1]华东理工大学,特种功能高分子材料及相关技术教育部重点实验室,上海200237

年份：2016

卷号：46

期号：3

起止页码：52

中文期刊名：宇航材料工艺

外文期刊名：Aerospace Materials & Technology

收录：CSTPCD;;北大核心:【北大核心2014】；CSCD:【CSCD2015_2016】；

语种：中文

中文关键词：含硅芳炔树脂;偶氮二甲酰胺;脲素;导热性能

外文关键词：Silicon-containing arylacetylene resin;Azodicarbonamide;Urea;Thermal conductivity

摘要：以含硅芳炔树脂为基体,偶氮二甲酰胺(AC)为发泡剂,脲素为助发泡剂,通过树脂在固化的同时进行发泡,制备出工艺简单、结构基本可控的泡沫材料。研究结果表明,当泡沫材料密度约为0.578 g/cm^(3)时,泡孔直径约300μm,压缩强度为6.32 MPa,热导率为0.112 W/(m·K),介电常数为1.7左右。
The silicon-containing arylacetylene resin foam with controllable structure was prepared from siliconcontaining arylacetylene resin as matrix resin,azodicarbonamide(AC)as blowing agent and urea as co-blowing agent by foaming while the resin is curing.Experimental results revealed that a silicon-containing resin foam which had a density of 0.578 g/cm^(3)has a cell diameter of 300μm,a compression strength of 6.32 MPa,a thermal conductivity of0.112 W/(m·K),and dielectric constant of 1.7.