文献类型：期刊文献

英文题名：Inkjet printing electroless copper plating on aluminum nitride substrate

作者：Liu, Chengwei[1];Li, Sifang[1];Wang, Shuangshuang[1];Luo, Shuaiou[1];Zeng, Huidan[1];Wang, Deqiang[1]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Key Lab Ultrafine Mat, Minist Educ, Shanghai 200237, Peoples R China

年份：2023

卷号：37

外文期刊名：MATERIALS TODAY COMMUNICATIONS

收录：;EI(收录号：20234114849278);WOS:【SCI-EXPANDED(收录号:WOS:001149704000001)】；

基金：The authors gratefully acknowledge the financial support from Dr. Jianguo Huang from East China University of Science and Technology and the meaningful discussion on sintering process.

语种：英文

外文关键词：AlN ceramic; Copper seed layer; Formaldehyde-free electroless plating; Without sintering

摘要：Aluminum nitride (AlN) as a ceramic substrate with high thermal conductivity and mechanic strength is highly desired for high-powder density electrode devices. However, precisely metalating of AlN in an environmental friendly way is still challenging. Here, we develop a inkjet printing electroless plating technology for fabricating cupper electrode on AlN substrate. The copper ink prepared by CuSO4 center dot 5 H2O is firstly inkjet printed on AlN substrate followed reduced by a dimethylamine borane solution to form a copper seed. The AlN substrate with the copper seed layer was immersed into the formaldehyde-free environment-friendly electroless plating solution to deposit the copper layer. The prepared copper electrode demonstrated a smooth surface with robust tangential peel strength reaches 302.67 N.cm(-1) and excellent conductivity to 8.70 mu Omega cm. Furthermore, AlN substrate after 8 h electroless copper plating has excellent heat dissipation performance. Therefore, the inkjet printing electroless plating technology provide a promising route for scalable and precise metalating the ceramic substrates.