文献类型：专利

英文题名：New high temperature hybrid resin silazane aminophenyl acetylene-terminated poly(diethynylbenzene-silane) used for composite material substrate, ceramic precursor, antiablative material and photoelectric material

作者：CHEN M;NI L;WANG G;WANG M;ZHOU Q

机构：[1]UNIV EAST CHINA SCI & TECHNOLOGY

申请号：CN103333341-A

申请日：2013-06-25

公开日：2013-10-02

语种：英文

收录：DERWENT

摘要：NOVELTY - A high temperature hybrid resin silazane aminophenyl acetylene-terminated poly(diethynylbenzene-silane) (I) is new. USE - High temperature hybrid resin silazane aminophenyl acetylene-terminated poly(diethynylbenzene-silane) is used for composite material substrate, ceramic precursor, antiablative material and photoelectric material. ADVANTAGE - The high temperature hybrid resin silazane aminophenyl acetylene-terminated poly(diethynylbenzene-silane) is efficiently prepared with excellent storage stability. DETAILED DESCRIPTION - A high temperature hybrid resin silazane aminophenyl acetylene-terminated poly(diethynylbenzene-silane) of formula: HCC-Ar2-NH-Si(-R1)(-R2)-(CC-Ar1-CC-Si(-R1)(-R2))n-NH-Ar2-CCH (I) is new. R1,R2=H, alkyl or aryl; Ar1=p-xylene or m-xylene;and Ar2=p-xylene, m-xylene or o-xylene. An INDEPENDENT CLAIM is included for preparation of high temperature hybrid resin silazane aminophenyl acetylene-terminated poly(diethynylbenzene-silane).