文献类型：期刊文献

英文题名：Investigation of synthesized carbazole derivative Cz-BPDB as a high-performance leveler for copper electroplating

作者：Yuan, Bo;Zhou, Wenhao;Li, Xuyang;Xie, Yiqiu;Yin, Xinpeng;Chen, Xin;Shen, Danyan;Wang, Limin[1]

机构：[1]East China Univ Sci & Technol, Sch Chem & Mol Engn, Shanghai Key Lab Funct Mat Chem, 130 Meilong Rd, Shanghai 200237, Peoples R China; East China Univ Sci & Technol, Inst Fine Chem, Sch Chem & Mol Engn, 130 Meilong Rd, Shanghai 200237, Peoples R China

年份：2023

卷号：463

外文期刊名：SURFACE & COATINGS TECHNOLOGY

收录：;EI(收录号：20231613939530);WOS:【SCI-EXPANDED(收录号:WOS:000986043100001)】；

基金：This research was financially supported by the National Natural Science Foundation of China (21772039, 21272069) , and we gratefully acknowledged financial support from the Central Universities and Science and Technology Commission of Shanghai Municipality (21DZ2305000) . Support from the Fundamental Research Funds for the Central Universities (SLA13223001) .

语种：英文

外文关键词：Carbazole derivatives; Nucleation process; Through -hole electroplating; Leveler; Quantum chemical calculations

摘要：Electroplating additives, especially levelers of copper electroplating, are the most critical components of electroplating solutions in the manufacture of printed circuit boards and integrated circuits. A series of carbazole derivatives have been synthesized and used as levelers for through-hole electroplating. Electrochemical tests, theoretical calculations, and simulations were used to compare the various properties of the carbazole derivatives. Among them, the carbazole derivative Cz-BPDB was preferably subjected to electroplating which was demonstrated by metallographic microscopy, SEM, and XRD. To further investigate the mechanism of leveler CzBPDB, the nucleation model theory was used to explain the phenomenon of flat and smooth electroplating surfaces. The electrostatic potential plot and the average local ionization energy plot were employed to analyze the active sites of the Cz-BPDB. Moreover, the galvanostatic measurements were applied to investigate the interaction of the Cz-BPDB with PEG and SPS. Therefore, a more reasonable through-hole electroplating mechanism was proposed in electroplating solution with Cz-BPDB used as leveler. This work introduced an excellent performance leveler and contributed to the continuing development of the copper electroplating mechanism.