文献类型：期刊文献

英文题名：Preparation and properties of hollow glass bead filled silicone rubber foams with low thermal conductivity

作者：Gao, Jie[1];Wang, Jibin[1];Xu, Haiyan[1];Wu, Chifei[1]

机构：[1]E China Univ Sci & Technol, Sch Mat Sci & Engn, Shanghai 200237, Peoples R China

年份：2013

卷号：46

起止页码：491

外文期刊名：MATERIALS & DESIGN

收录：;EI(收录号：20125015793820);WOS:【SCI-EXPANDED(收录号:WOS:000314870000057)】；

基金：The author would like to thank project supported by the National Natural Science Foundation of China (Grant No. 51003029) and project supported by the Shanghai Postdoctoral Sustentation Fund, China (Grant No. 11R21412600).

语种：英文

外文关键词：Silica - Thermal insulation - Particle size - Rubber - Thermal conductivity - Compression molding - Hardness - Granular materials - Silicones - Filled polymers - Tensile strength

摘要：Silicone rubber foams filled with various content and different particle size of hollow glass bead (HGB) were prepared by compression molding. It was revealed that compared with silica filled silicone rubber foams, HGB filled materials achieved higher foaming extent, lower thermal conductivity, and lower hardness, which can be significant for thermal insulation materials. For HGB filled materials, the morphology indicated the average cell size decreased with higher HGB content and larger particle size of HGB. The density, thermal conductivity, hardness and tensile strength increased with higher HGB content and larger particle size of HGB. (C) 2012 Elsevier Ltd. All rights reserved.