文献类型：期刊文献

英文题名：Experiment and numerical simulation on uniformity of thermal-flow field in advanced package electroplating cell

作者：Wang, Chang-Hong[1]; Zhu, Dong-Sheng[1,2]; Zhou, Xuan[1]; Tu, Shan-Dong[2]

机构：[1] School of Chemical and Energy Engineering, South China University of Technology, Guangzhou 510640, China; [2] Department of Mechanical and Power Engineering, East China University of Science and Technology, Shanghai 200237, China

年份：2008

卷号：13

期号：SUPPL.

起止页码：3

外文期刊名：Journal of Shanghai Jiaotong University (Science)

收录：EI(收录号：20082611337413)

语种：英文

外文关键词：Computational fluid dynamics - Computer simulation - Electroplating - Enclosures - Flow fields - Heat convection - Heat transfer - Heat transfer coefficients - Natural convection - Temperature distribution

摘要：An experimental facility of advanced packaging electroplating cell was developed to study the uniformity of the temperature and flow field in the high precision electroplating cell. Based on heat transfer and computational fluid dynamics, a 2D numerical model was founded to analyze the temperature field and flow field of the experimental electroplating cell enclosure. Combing with test and simulated results, the effects of the heat source intensity, ventilated mode and heat transfer coefficient on the thermal field of the cell were discussed. The experimental and simulated results give a way to enhance the uniformity of the temperature field and flow field and to improve the quantity of the WL-CSP electroplating.