文献类型：期刊文献

中文题名：双(N-间乙炔基苯基邻苯二甲酰亚胺)醚改性甲基二苯乙炔基硅烷

英文题名：DI-N-M-ACETYLENE-PHENYLPHTHALIMIDE-ETHER MODIFYING METHYL-DI-PHENYLACETYLENE-SILANE

作者：戴泽亮[1];陈麒[1];倪礼忠[1]

机构：[1]华东理工大学材料科学与工程学院复合材料教科组,上海200237

年份：2005

卷号：22

期号：5

起止页码：89

中文期刊名：复合材料学报

外文期刊名：Acta Materiae Compositae Sinica

收录：CSTPCD;;EI(收录号：2005499528236);Scopus;北大核心:【北大核心2004】；CSCD:【CSCD2011_2012】；

基金："863"计划项目(2003AA350660)

语种：中文

中文关键词：甲基二苯乙炔基硅烷;改性;耐高温;复合材料

外文关键词：methyl-di-phenylacetylene-silane; modification; high temperature-resistance; composites

摘要：甲基二苯乙炔基硅烷(MDPES)聚合后具有耐高温、低介电损耗等优异性能,但力学性能低。采用双(N-间乙炔基苯基邻苯二甲酰亚胺)醚(DAIE)添加到MDPES中进行共聚改性。通过二者不同质量配比的共聚反应发现,当MDAIE/MMDPES=4∶5时,共聚后改性效果较好,在氮气中的Td5(质量损失5%时的温度)为467℃,800℃时质量保留率为82.7%,所制备的复合材料在常温下弯曲强度达到274 MPa;高温弯曲强度保留率为88.5%。在频率为1 MHz时介电常数为4.18,介电损耗角正切tanδ为2.5×10-3。
Polymer of methyl-di-phenylacetylene-silane （MDPES） possesses excellent properties of high temperature-resistance, low dielectric dissipation fraction, etc, but its mechanical property is not significant for its poor bonding with glass-fiber. The di-N-m-acetylene-phenylphthalimide-ether （DAIE） was added into MDPES to modify its properties through copolymerization. To research copolymerization of DAIE and MDPES at different mass ratios, it was found that when MDAIE/MMDPES Was 4 t 5, the value of Ta5 （temperature of 5% weight loss） is 467℃ in nitrogen; its mass residual ratio is 82.7% based on the initial mass at 800℃ in nitrogen; the flexural strength at room temperature is 274 MPa; the flexural strength at 235C is 241 MPa; the flexural strength retention at 235℃ is 88.5%; its permittivity is 4. 18 and tanδ is 2.5× 10^-3 in the frequency of 1 MHz.