文献类型：期刊文献

中文题名：Ca_(0.7)La_(0.2)TiO_(3)陶瓷填充含硅芳炔/苯并噁嗪树脂复合材料的制备及性能

英文题名：Preparation and Properties of Ca_(0.7)La_(0.2)TiO_(3) Ceramic Filled Silica-Containing Arylacetylene/Benzoxazine Resin Composites

作者：张恒[1];王桂徽[1];胡蔚[1];万立[2];侯进森[2];杜磊[1];邓诗峰[1]

机构：[1]华东理工大学材料科学与工程学院,特种功能高分子材料及相关技术教育部重点实验室,上海200237;[2]上海复合材料科技有限公司,上海201114

年份：2021

卷号：34

期号：6

起止页码：512

中文期刊名：功能高分子学报

外文期刊名：Journal of Functional Polymers

收录：CSTPCD;;北大核心:【北大核心2020】；CSCD:【CSCD2021_2022】；

基金：装备发展部重点基金(61409220301)。

语种：中文

中文关键词：含硅芳炔树脂;苯并噁嗪;介电性能;力学性能;热性能

外文关键词：Si-containing arylacetylene resin;benzoxazine;dielectric property;mechanical property;thermal property

摘要：以含硅芳炔树脂(PSA)和苯并噁嗪树脂(BOZ)为基体,Ca_(0.7)La_(0.2)TiO_(3)(CLT)陶瓷为填料,通过本体浇铸成功制备了CLT/PSA/BOZ复合材料。结果表明,加入体积分数为10%的BOZ后,共混树脂的固化收缩率降低了57%。当填料体积分数为50%、测试频率为10 GHz时,CLT/PSA/BOZ(φBOZ=10%)复合材料的介电常数增至30.01,介电损耗因子降至0.0035,弯曲强度增至63.75 MPa,导热系数增至0.6990 W/(m·K),热膨胀系数降至2.3×10^(?5)℃^(?1),同时复合材料质量损失5%的热分解温度(T_(d5))超过900℃。该复合材料的耐高温性能十分优异,在高频通信、集成电路及航空航天等领域应用前景广泛。
CLT/PSA/BOZ composites were prepared by body casting using Si-containg arylacetylene(PSA)and benzoxazine(BOZ)resins as the matrix and Ca_(0.7)La_(0.2)TiO_(3)(CLT)ceramic as the filler.The results show that the curing shrinkage of the resin is reduced by 57%after the addition of 10%(volume fraction)BOZ.When the packing volume fraction is 50%and the test frequency is 10 GHz,the dielectric constant of the composite material increases to 30.01,the dielectric dissipation factor decreases to 0.0035,the bending strength increases to 63.75 MPa,the thermal conductivity increases to 0.6990 W/(m·K),and the thermal expansion coefficient decreases to 2.3×10^(?5)℃^(?1).At the same time,the decomposition temperature of 5%mass loss(T_(d5))is more than 900℃.CLT/PSA/BOZ composites have wide application prospect in high frequency communication,integrated circuit,aerospace and other fields because of their excellent high temperature resistance.