文献类型：期刊文献

英文题名：Synthesis, characterization, and properties of a novel propargyl ether naphthalene phenolic resin

作者：Chen, Yuzhi[1];Guo, Kangkang[2];Wang, Fan[1];Zhu, Yaping[1];Qi, Huimin[1,3]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Minist Educ, Key Lab Specially Funct Polymer Mat & Related Tech, Shanghai, Peoples R China;[2]Mater Wing Mat Sci & Technol Su Zhou Co Ltd, Shanghai, Peoples R China;[3]East China Univ Sci & Technol, Sch Mat Sci & Engn, Minist Educ, Key Lab Specially Funct Polymer Mat & Related Tech, Shanghai 200237, Peoples R China

年份：2024

卷号：35

期号：1

外文期刊名：POLYMERS FOR ADVANCED TECHNOLOGIES

收录：;EI(收录号：20234515013184);WOS:【SCI-EXPANDED(收录号:WOS:001094927500001)】；

基金： Key Laboratory of Specially Functional Polymeric Materials and Related Technology of Ministry of Education, School of Material Science and Engineering, East China University of Science and Technology, Grant/Award Number: 50321041918013; Fundamental Research Funds for the Central Universities, Grant/Award Number: 50321041917001

语种：英文

外文关键词：high-temperature resistant resin; naphthalene ring; propargyl ether; thermal expansion

摘要：In this study, 1,5-dihydroxynaphthalene moiety was introduced into a novolac resin structure, and propargyl ether naphthalene phenolic resin (PNPF) was synthesized by the Williamson etherification reaction, which improved the heat resistance of the resin and its processability. The structure of the PNPF resin was characterized using H-1 NMR and FTIR analysis, and its processability, heat resistance, thermal expansion, and dielectric properties were evaluated. The results revealed that the addition of 1,5-dihydroxylhine, increased the reaction activity of the PNPF resin, and decreased its initial curing temperature, with the resin exhibiting excellent processability. The cured resin also showed excellent heat resistance and thermomechanical properties. The 5% weight loss temperature (T-d5) and glass transition temperature (T-g) of the resin increased to 437.61 and 362.04 degrees C, respectively, while the coefficient of thermal expansion decreased from 60.17 to 44.52 ppm, with a reduction of 26.01%. Moreover, the dielectric constant and dielectric loss of the cured resin were 3.02 and 0.00239, respectively.