文献类型：期刊文献

英文题名：Controllable fabrication of Sn-coated Cu micro-flakes via self-circulating electroplating

作者：Zhao, Hengyu[1];Wang, Baoyu[1];Yang, Shiqing[1];Zhu, Huamiao[1];Zhang, Zihao[2];Li, Wenyao[2];Yang, Xiangmin[2];Fang, Bin[2];Liang, Ying[2];Zhang, Zhen[2]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Sch Phys, 130 Meilong Rd, Shanghai 200237, Peoples R China

年份：2026

卷号：61

期号：4

起止页码：2704

外文期刊名：JOURNAL OF MATERIALS SCIENCE

收录：;EI(收录号：20255219801982);WOS:【SCI-EXPANDED(收录号:WOS:001644327400001)】；

基金：This work was supported by the Undergraduate Training Program on Innovation and Entrepreneurship under Grant No. 202510251085 and No. 202510251118S. The authors thank Research Center of Analysis and Test, 985 test platform of School of Chemical Engineering of East China University of Science and Technology for the technique support. The authors thank Shuanglong Yuan for helpful discussions.

语种：英文

外文关键词：Copper - Fillers - Powder metals - Tin

摘要：As conductive fillers, the uniformity and compactness of composite metal powders are crucial for preparing high-performance conductive pastes. In this study, a self-circulating electroplating method was proposed, which could efficiently deposit Sn plating on the seed of Cu micro-flakes to prepare composite metal powders. The effects of total electroplating time, single electroplating time, loading mass of Cu seeds on the cathode support, and the bath temperature on Sn plating layer have been systematically investigated and optimized. And the influence mechanisms of electroplating parameters on coating coverage, compactness, and uniformity of Sn plating layer were proposed. The Sn-coated Cu micro-flakes with compact plating layer of 142.9 nm thickness were obtained with the total electroplating time of 60 min, the single electroplating time of 3 min, and the loading mass of Cu seeds of 18 mg/cm2 at the bath temperature of 15 degrees C. Finally, the as-prepared Sn-coated Cu micro-flakes were used as fillers to prepare conductive pastes, which exhibited good antioxidation performance at 85 degrees C and 85%R.H.