文献类型：期刊文献

中文题名：小型化电子产品热应变作用下接触传热仿真分析

英文题名：Simulation analysis of contact heat transfer under thermal strain for miniaturized electronics

作者：肖卫强[1];李特[2];蒋健[1];徐建[1];周国俊[1];汪华文[1];韩玉峰[2];詹望成[2]

机构：[1]浙江中烟工业有限公司,浙江杭州310008;[2]华东理工大学工业催化研究所,上海200237

年份：2023

卷号：51

期号：1

起止页码：97

中文期刊名：福州大学学报（自然科学版）

外文期刊名：Journal of Fuzhou University(Natural Science Edition)

收录：CSTPCD;;北大核心:【北大核心2020】；

基金：国家自然科学基金资助项目(21922602)。

语种：中文

中文关键词：接触传热;粗糙度;热应变;有限元;计算流体力学;热通量

外文关键词：contact heat transfer;roughness;thermal strain;finite element;computational fluid dynamics;heat flux

摘要：在设计小型化结构特征电子产品的过程中,组件在工作时的热应变对接触传热影响难以估算.针对此问题,以聚丙烯(PP)和316不锈钢(SS316)材料作为研究对象,采用粗糙度微观理论建立粗糙接触面等效接触几何模型,研究其接触传热.采用有限元方法模拟PP/SS316、SS316/SS316组合模型的热应变,采用计算流体力学方法研究热应变模型的传热过程.结果表明:在普通工业和消费电子领域的传热仿真中,微米和亚毫米级间隙中的气体对流和辐射对总传热影响可以忽略;圆台模型更适合于描述高弹性模量材料的粗糙峰;PP/SS316组合热应变主要发生在接触面平坦位置,热变形量大为2.6μm;接触间隙空气传热通量占比随间隙和材料热导率的增加而减少,而与材料使用温度无关.
In the process of designing electronic products with miniaturized structural features,it is difficult to estimate the influence of thermal strain on contact heat transfer of components during operation.Herein,contact heat transfer between polypropylene(PP)and 316 stainless steel(SS316)was studied.The equivalent geometry model of rough contact surface was established based on roughness microscopic theory.The thermal strain of PP/SS316 and SS316/SS316 models was simulated by finite element method.The heat transfer process in the thermal strain model was studied by calculating fluid mechanics.The results showed that gas convection and radiation in micron and submillimeter scale gaps have negligible effects on total heat transfer gravity and radiation had no effect on contact heat transfer.The rounding model is better for describing rough peaks of materials with high elastic modulus.Thermal strain mainly occurs in the gap flat location,and thermal deformation of PP/SS316 model is up to 2.6μm.The proportion of air heat transfer in the contact gap decreases with the increase of gap and thermal conductivity of material,regardless of operation temperature of the material.