文献类型：期刊文献

中文题名：基于金刚石氮–空位色心的微波磁场成像技术的可靠性研究

英文题名：Study on the reliability of microwave magnetic field imaging technique based on diamond nitrogen-vacancy color centers

作者：唐雨桐[1];叶安[1];付鼎元[1];李晓林[1];张超[2]

机构：[1]华东理工大学物理学院,上海200237;[2]北京卫星环境工程研究所,北京100094

年份：2023

卷号：40

期号：6

起止页码：682

中文期刊名：航天器环境工程

外文期刊名：Spacecraft Environment Engineering

收录：CSTPCD;;北大核心:【北大核心2020】；CSCD:【CSCD2023_2024】；

基金：民用航天预研项目D040301。

语种：中文

中文关键词：单片微波集成电路;失效模式分析;磁成像;氮-空位色心;芯片热态可靠性

外文关键词：monolithic microwave integrated circuit;failure mode analysis;magnetic imaging;nitrogen-vacancy color center;chip thermal reliability

摘要：相对于单片微波集成电路(MMIC)芯片的设计与制造工艺发展,芯片的测试与失效分析研究进展缓慢。文章首先调研了基于金刚石氮–空位(NV)色心的高空间分辨率微波磁成像应用及通过磁成像技术反演电流分布的技术进展;继而进行了基于NV色心系综微波磁场成像技术的MMIC热态可靠性研究。结果表明:利用基于金刚石NV色心的微波磁场成像技术,对毫米波微波芯片表面的二维矢量场进行高空间分辨率、高灵敏度的快速成像与重构,可以采集芯片在正常和非正常工作状态下的磁场成像信息;进一步对微波芯片内部的信息进行反演重建,可以实现芯片内部故障点的精确定位诊断和潜在故障点排除。所做研究有望为芯片设计、生产、测试提供可靠性诊断。
Compared with the development of chip design and manufacturing of monolithic microwave integrated circuits(MMIC),the research on testing and failure analysis of chips has been progressing slowly.In this paper,the application of high-spatial resolution microwave magnetic imaging based on diamond nitrogen-vacancy(NV)color center and the technical progress of inversion current distribution by magnetic imaging were firstly reviewed.On this basis,the thermal reliability of MMIC based on NV color center ensemble microwave magnetic field imaging technology was studied.The results show that,by using the microwave magnetic field imaging technology based on the diamond NV color center,through the rapid imaging and reconstruction of the two-dimensional vector field on the surface of the millimeter wave microwave chip with high spatial resolution and high sensitivity,the magnetic field imaging information of both normal and abnormal working states of chips can be collected.The precise positioning and diagnosis of the fault points inside the chip and the elimination of potential fault points can be realized by further inversion and reconstruction of the internal information of the microwave chip.The proposed research is expected to provide reliability diagnosis for chip design,production and testing.