文献类型：期刊文献

英文题名：Preparation of biphenyl-containing polybenzoxazines with low dielectric constants and high thermal stability

作者：Lu, Angui[1];Lin, Hao[1];Yuan, Manlin[1];Shao, Liyan[1];Lu, Xin[1];Xin, Zhong[1]

机构：[1]East China Univ Sci & Technol, Shanghai Key Lab Multiphase Mat Chem Engn, Dept Prod Engn, Shanghai 200237, Peoples R China

年份：2023

卷号：280

外文期刊名：POLYMER

收录：;EI(收录号：20232114134338);WOS:【SCI-EXPANDED(收录号:WOS:001009717600001)】；

基金：Acknowledgements This work was financially supported by Innovation Program of Shanghai Municipal Education Commission (2019-01-07-00-02- E00061) and National Natural Science Foundation of China (21776080) .

语种：英文

外文关键词：Benzoxazine; Biphenyl; Dielectric

摘要：In this work, two biphenyl-containing benzoxazine monomers (C-tfmb and C-dmb) have been synthesized using 2,2 '-bis(trifluoromethyl)benzidine/2,2 '-dimethylbenzidine, 4-cyclohexylphenol and paraformaldehyde as raw materials. The thermal curing behaviors of the benzoxazine monomers were investigated by Fourier transform infrared spectroscopy and non-isothermal differential scanning calorimetry. After curing, the biphenylcontaining polybenzoxazines (PC-tfmb and PC-dmb) exhibited high thermal stability with the 5% weight loss temperatures at 335 degrees C and 367 degrees C, respectively. Moreover, both polybenzoxazine films showed high hydrophobicity and low dielectric properties. Due to the presence of low-polarity and bulky cyclohexyl and trifluoromethyl groups, PC-tfmb had a dielectric constant of 2.78 and a dielectric loss of 0.0035 at 1 MHz.