文献类型：期刊文献

英文题名：Mechanistic insights into enhanced electroplating of ultra-thin copper foils using ADT-DMAP as a superior acridone-based leveler

作者：Xie, Jingyu[1,2];Zhou, Nayun[1,2];Ye, Wenlong[1,2];Chen, Xin[1,2];Wang, Limin[1,2]

机构：[1]East China Univ Sci & Technol, Shanghai Key Lab Funct Mat Chem, 130 Meilong Rd, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Inst Fine Chem, Sch Chem & Mol Engn, Shanghai Elect Chem Innovat Res Inst, 130 Meilong Rd, Shanghai 200237, Peoples R China

年份：2025

卷号：55

期号：7

起止页码：1911

外文期刊名：JOURNAL OF APPLIED ELECTROCHEMISTRY

收录：;EI(收录号：20250717874008);WOS:【SCI-EXPANDED(收录号:WOS:001414782600001)】；

基金：We gratefully acknowledge financial support from the Central Universities and Science and Technology Commission of Shanghai Municipality (21DZ2305000). Support from the Fundamental Research Funds for the Central Universities (SLA13223001).

语种：英文

外文关键词：Acridone; Acridone quaternary ammonium salts; Electrodeposition copper foil; Levelers

摘要：With the advancement of the information age, ultra-thin copper foil used in lithium-ion batteries demands higher mechanical strength and lower surface roughness, making these two factors a key constraint for the progress of the entire lithium battery industry. The production of ultra-thin, tensile-resistant electroplated copper foil with only trace additives presents significant technical challenges. In this study, four quaternary ammonium salts based on acridone were synthesized and evaluated as levelers for copper electroplating. Electrochemical assays and molecular dynamics simulations revealed that quaternary ammonium salt synthesized from acridone and 4-diaminopyridine ADT-DMAP demonstrated the most effective cathodic adsorption and suppression among the compounds tested. Scanning Electron Microscopy, X-ray Diffraction, Electron Backscatter Diffraction, and Atomic Force Microscopy analyses confirmed that ADT-DMAP exhibited exceptional leveling performance in electroplating, enabling the production of ultra-thin copper foils with smooth surfaces and enhanced tensile strength. Furthermore, the leveling mechanism of ADT-DMAP and its synergistic interaction with SPS were analyzed using electrostatic potential and average local ionization energy calculations.