文献类型：期刊文献

英文题名：Quinacridone skeleton as a promising efficient leveler for smooth and conformal copper electrodeposition

作者：Wang, Xiaomin[1,2];Wang, Kang[1,2];Xu, Jie[1,2];Li, Jun[1,2];Lv, Jinge[1,2];Zhao, Min[1,2];Wang, Limin[1,2,3]

机构：[1]East China Univ Sci & Technol, Sch Chem & Mol Engn, Shanghai Key Lab Funct Mat Chem, 130 Meilong Rd, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Sch Chem & Mol Engn, Inst Fine Chem, 130 Meilong Rd, Shanghai 200237, Peoples R China;[3]Chinese Acad Sci, Shanghai Inst Organ Chem, Key Lab Organofluorine Chem, 345 Lingling Rd, Shanghai 200032, Peoples R China

年份：2020

卷号：181

外文期刊名：DYES AND PIGMENTS

收录：;EI(收录号：20202508838285);WOS:【SCI-EXPANDED(收录号:WOS:000549169800008)】；

基金：This research was financially supported by the National Natural Science Foundation of China (21772039, 21272069), and we gratefully acknowledge financial support from the Central Universities and Key Laboratory of Organofluorine Chemistry, Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences. Support from the Chinese Scholarship Council is also acknowledged.

语种：英文

外文关键词：Quinacridone; Structural modification; Leveler; Copper electrodeposition; Low concentration

摘要：Superconformal copper electrodeposition of nano-micro printed circuit board (PCB) is of prime importance in microelectronics manufacturing. It is very challenging and still remains deficient exploration to fully realize efficient conformal electrodeposition in the emerging organic additives. Herein, a family of quinacridone (QA) derivatives bearing quaternary ammonium groups were synthesized via two steps with high yields. These compounds were functionalized as promising levelers for superconformal Cu deposition for the first time. Alkyl chains and aryl groups tuning strategies were performed to precisely synthesize and optimize these QA levelers. The optimal leveling agent (DCQA-C-8-QAS) and electrodeposition formula were obtained through electrochemical measurements, theoretical calculations and through-hole (TH) electrodeposition experiments. The superior leveling behavior of DCQA-C-8-QAS was mainly attributed to the strong interaction and adhesion ability towards copper surface, which were verified by X-ray photoelectron spectra (XPS), atomic force microscope (AFM) and contact angle detection (CA).