详细信息

A Novel Bio-Based Phase Change Hydrogel Via Schiff Base for Efficient Thermal Management  ( EI收录)  

文献类型:期刊文献

英文题名:A Novel Bio-Based Phase Change Hydrogel Via Schiff Base for Efficient Thermal Management

作者:Wang, Jinheng[1]; Li, Chenyuan[1]; Wang, Jikui[1]; Guo, Weihong[1]

机构:[1] Key Laboratory for Ultrafine Materials of Ministry of Education, Shanghai Key Laboratory of Advanced Polymeric Materials, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai, 200237, China

年份:2025

外文期刊名:SSRN

收录:EI(收录号:20250123527)

语种:英文

外文关键词:Amination - Crosslinking - Flexible electronics - Latent heat - Self-healing materials

摘要:Phase change materials (PCMs) have attracted significant attention in electronic thermal management owing to their exceptional energy storage density. However, conventional PCMs face critical technical limitations, including leakage issues and self-healing deficiencies, which significantly constrain their application scope and operational lifespan. To address these challenges, a novel phase change hydrogel was developed for advanced thermal management via synergistic coupling between water-mediated evaporative cooling and polyethylene glycol (PEG)-based latent heat storage. This bio-based hydrogel was synthesized through dynamic Schiff base reaction, utilizing aminated PEG as both phase change component and crosslinker. The phase change hydrogel exhibits high latent heat (ΔHm = 110.4 J/g), high thermal reliability and stability as well as intrinsic self-healing properties enabled by Schiff base bonds and hydrogen bonds. This innovative synthetic method proposes a new strategy for the preparation of PEG-based solid-solid phase change materials. Simulated thermal management studies prove the efficient thermal management capabilities of the phase change hydrogel (10 °C reduction) with no observable leakage. The phase change hydrogel prepared in this study opens new avenues for developing sustainable, high-performance thermal management materials with self-healing capability, showing great potential for the application in flexible electronics and integrated circuits. ? 2025, The Authors. All rights reserved.

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