文献类型：期刊文献

英文题名：Synthesis and properties of poly(dimethylsilylene-ethynylene-phenoxyphenoxyphenylene-ethynylene)

作者：Chen, Huigao[1];Xin, Hao[1];Lu, Jiarong[1];Tang, Junkun[1];Yuan, Qiaolong[1];Huang, Farong[1]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Key Lab Specially Funct Polymer Mat & Related Tec, Minist Educ, Shanghai, Peoples R China

年份：2017

卷号：29

期号：5

起止页码：595

外文期刊名：HIGH PERFORMANCE POLYMERS

收录：;EI(收录号：20172203717360);WOS:【SCI-EXPANDED(收录号:WOS:000402272600010)】；

语种：英文

外文关键词：Poly(dimethylsilylene-ethynylene-phenoxyphenoxyphenylene-ethynylene); silicon-containing arylacetylene resin; high performance resin for composite; 1; 4-bis(p-ethynylphenoxy)benzene

摘要：A novel resin, poly(dimethylsilylene-ethynylene-phenoxyphenoxyphenylene-ethynylene), was synthesized from 1,4-bis(p-ethynylphenoxy)benzene and dimethyldichlorosilane through Grignard reaction. The structures of the monomer and the resin were characterized by elemental analysis, Fourier transform infrared, proton nuclear magnetic resonance, electron ionization-mass spectrometry and gel permeation chromatography. The thermal behaviour of the resin was examined by differential scanning calorimetry. The cured resin exhibits excellent dielectric property, high glass transition temperature, good mechanical properties and high thermal stability. The flexural strength and impact strength of the cured resin were 55.0 MPa and 10.5 KJ m(-2), respectively. The degradation temperature at 5% weight loss of the cured resin arrived at 549 degrees C in nitrogen.