文献类型：期刊文献

英文题名：Thermal decomposition investigation on heat-resistant poly (dimethylsilylene ethynylenemethylphenylene-methylenemethylphenyleneethynylene) resins

作者：Liu, Xiaotian[1];Lv, Shuaikang[1];Tang, Junkun[1];Long, Donghui[2];Yuan, Qiaolong[1];Huang, Farong[1]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Key Lab Specially Funct Mat & Related Technol, Minist Educ, 130 Meilong Rd, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Sch Chem Engn, Key Lab Specially Funct Mat & Related Technol, Minist Educ, 130 Meilong Rd, Shanghai 200237, Peoples R China

年份：2023

卷号：724

外文期刊名：THERMOCHIMICA ACTA

收录：;EI(收录号：20231213755337);WOS:【SCI-EXPANDED(收录号:WOS:000958195500001)】；

基金：The authors gratefully acknowledge the support of the Fundamental Research Funds for the Central Universities (no. JKD01231701) .

语种：英文

外文关键词：Thermal stability; Decomposition mechanism; High performance resin; Poly (dimethylsilylene  ethynylenealkylphenylenmethylenealkylpheny  leneethynylene); Silicon-containing arylacetylene resin

摘要：Thermal decomposition of heat resistant poly(dimethylsilylene ethynylenemethylphenylenemethylenemethyl-phenyleneethynylene) (PSMA) resins has been investigated by TGA, Py-GC-MS, and TGA-MS analysis tech-niques. The decomposition kinetics was studied with Kissinger-Akahira-Sunose method (KAS method). The results show that the decomposition of the cured PSMA resins is obviously influenced by the presence and lo-cations of the side methyl groups on the benzene rings and their decomposed fragments are different. The side methyl groups on benzene rings easily break down, which make the resins decompose at lower decomposition temperatures. The cleavage of the side methyl groups further induces the decomposition of the main chains of the resins and results in low residue yields. The decomposition mechanisms of the cured PSMA resins are suggested.