文献类型：期刊文献

中文题名：SiO_2中空微球改性含硅芳炔树脂及其复合材料的结构与性能

英文题名：Structure and properties of SiO_2 hollow microspheres modified Si-containing arylacetylene resin and their composites

作者：胡永彬[1];王帆[1];朱亚平[1];齐会民[1]

机构：[1]华东理工大学材料科学与工程学院特种功能高分子材料及其相关技术教育部重点实验室,上海200237

年份：2019

卷号：36

期号：3

起止页码：592

中文期刊名：复合材料学报

外文期刊名：Acta Materiae Compositae Sinica

收录：CSTPCD;;EI(收录号：20191706838538);Scopus;北大核心:【北大核心2017】；CSCD:【CSCD2019_2020】；

基金：国家自然科学基金(90816021)

语种：中文

中文关键词：含硅芳炔树脂;SiO2中空微球;增韧;力学性能;介电性能

外文关键词：Si-containing arylacetylene resin;SiO2 hollow microspheres;toughness;mechanical properties;dielectric properties

摘要：采用SiO_2中空微球对含硅芳炔树脂(PSAC)进行改性,制备了SiO_2/PSAC复合材料,以改善PSAC固化后质脆的缺点,提高PSAC基复合材料的力学性能,拓展PSAC在航空航天领域的应用。对SiO_2/PSAC复合材料和石英纤维布增强SiO_2/PSAC(QF-SiO_2/PSAC)复合材料的结构与性能进行了研究,采用SEM分析SiO_2/PSAC树脂浇铸体和QF-SiO_2/PSAC复合材料断面微观结构,并分析SiO_2的增韧机制。采用DMA和TGA分析了SiO_2/PSAC复合材料耐热性能和热稳定性,虽然SiO_2会导致树脂耐热性能略有下降,但其中空结构使树脂具有优异介电性能。当SiO_2的添加量达2wt%时,SiO_2/PSAC树脂浇铸体弯曲强度达22.3 MPa,失重5%温度为551℃,1 000℃残留率为86.5%;QF-2SiO_2/PSAC复合材料的弯曲强度为298.3MPa,弯曲模量达31.0GPa,分别提高了27.5%、59.0%;当SiO_2添加量为5wt%时,QF-5SiO_2/PSAC复合材料的剪切强度提高了16.0%。
SiO2 hollow microspheres modified Si-containing arylacetylene resin(SiO2/PSAC)casting was prepared to ameliorate the brittleness of cured Si-containing arylacetylene resin and to improve the mechanical properties of the SiO2/PSAC resin casting and to meet the need of the application in the field of aeronautics and astronautics.The structure and properties of the SiO2/PSAC resin casting and quartz fiber reinforced SiO2/PSAC(QF-SiO2/PSAC)composites were investigated.The microstructure of SiO2/PSAC resin castings and QF-SiO2/PSAC composites were observed by SEM,and the toughening mechanism of SiO2 was analyzed.The heat resistance and thermal stability of SiO2/PSAC composites were studied by DMA and TGA.The heat resistance of the resin decreased slightly,but the porous structure made the resin excellent in dielectric properties.Meanwhile,when the content of SiO2 is added to 2 wt%,the flexural strength of SiO2/PSAC resin casting is 22.3 MPa.The temperature of decomposition(Td5)is 551℃ and the char yield at 1 000℃ is 86.5%;the flexural strength of QF-2 SiO2/PSAC composite is298.3 MPa,and the modulus reaches 31.0 GPa,which increases by 27.5% and 59.0%,respectively;When the content of SiO2 is 5 wt%,the shear strength of QF-5 SiO2/PSAC composite increases by 16.0%.