文献类型：期刊文献

英文题名：Curing behavior of a novel polytriazole resin

作者：Wan, Liqiang[1]; Tian, Jianjun[1]; Huang, Jianzhi[1]; Hu, Yanhong[1]; Huang, Farong[1]; Du, Lei[1]

机构：[1]E China Univ Sci & Technol, Sch Mat Sci & Engn, Key Lab Ultrafine Mat, Minist Educ, Shanghai 200237, Peoples R China

年份：2007

卷号：106

期号：3

起止页码：2111

外文期刊名：JOURNAL OF APPLIED POLYMER SCIENCE

收录：;EI(收录号：20074110857583);WOS:【SCI-EXPANDED(收录号:WOS:000249312000085)】；

语种：英文

外文关键词：polytriazole resin; DSC; kinetics; rheological behavior

摘要：The curing behavior of a novel low temperature curing polytriazole resin, prepared from p-xylylene diazide and N,N,N',N'-tetrapropargyl-p,p'-diaminodiphenylmethane, was investigated by DSC and rheological analyses. The kinetics of the curing of the resin was studied by nonisothermal and isothermal DSC measurements and the kinetics parameters were obtained. The values of apparent activation energy E, of the curing reaction obtained by nonisothermal and isothermal DSC are 80.7 and 75.3 kJ/mol, respectively. The curing of the resin was traced by the isothermal rheological analysis. The gelation times of the resin at 70, 75, 80, and 85 degrees C are about 200, 150, 110, and 75 min, respectively. The viscosity equation for the resin was found as follows: In eta = -107 + 33.5X10(3)/T + texp (26.3 + 9.87X10(3)/T) (C) 2007 Wiley Periodicals, Inc.