文献类型：期刊文献

中文题名：丙烯酸树脂活化银胶的制备、结构与性能

英文题名：Preparation,Structure and Properties of Acrylic Resin Activating Silver Adhesive

作者：聂旭坤[1];方斌[1];袁双龙[1];梁莹[1]

机构：[1]华东理工大学理学院核技术应用研究所,上海200237

年份：2018

卷号：31

期号：6

起止页码：609

中文期刊名：功能高分子学报

外文期刊名：Journal of Functional Polymers

收录：CSTPCD;;北大核心:【北大核心2017】；CSCD:【CSCD2017_2018】；

语种：中文

中文关键词：印制电路板;加成法;活化胶

外文关键词：printed circuit board;addition process;activating adhesive

摘要：以丙烯酸树脂和环氧树脂的混合物为基体,以银粉为填料,制备活化银胶。将银胶涂覆于聚对苯二甲酸乙二酯(PET)基材上,形成导电涂层,考察了涂层的可催化化学镀铜特性以及涂层与基材的结合力;同时考察了丙烯酸树脂与环氧树脂的质量比对活化胶的交联度、剥离强度、胶层可镀性的影响,基体的镀液渗透性与胶层可镀性的关系,以及活化胶中银粉含量和分散性、胶层干燥固化过程中的分散稳定性对活化胶性能的影响。结果表明:当活化胶交联度为59.8%、银粉与树脂的质量比为2∶1时,胶层具有良好的镀液渗透性,此时胶层可镀性好,并具有较高的剥离强度。
The subtraction process is prevailing in manufacturing printed circuit board although it causes problems such as high cost,serious environment pollution and long production cycle.These problems could be solved through the usage of the addition process.Through screen printing or inkjet printing,the prevalent addition process prints the conductive paste or ink directly on the insulating media to form the circuit.However,this process is limited by the shortage of the conductivity of the circuit,which could be improved significantly by applying electroless plating on the printed circuit.Unfortunately,it is impossible to apply electorless plate on the circuit pattern using current conductive paste or ink.A new addition process for manufacturing printed circuits was focused on.A novel ink was prepared by dispersing silver powders into the solution of acrylic resin with epoxy resin in ethanol,and then coated on the PET substrate to form an activating layer after thermal curing.This paper investigated the electroless copper plating on the activating layer and its binding force with substrate,the ratio of two kinds of resins and its effect on the crosslinking degree,bond strength and plating ability of the activating coating,relationships between the permeability and the plating ability of the coating in plating baths,and how the properties of the coating were affected by the amount,dispersion and dispersion stability of the silver powder during drying and curing.The results showed that the plating ability(on PET substrate)and the peeling strength of the activating adhesive increased by adjusting the curing crosslinking degree and the amount of the silver powder in the coating layer,respectively.When the crosslinking degree of the coating was 59.8%and the mass ratio of silver powder to resin was 2∶1,a uniform and continuous plating layer could be obtained.The peeling strength of the layer reached 16 N/cm,a value exceeded the current industrial level.It was found that the plating ability was determined by the plating bath permeability.Furthermore,the dispersion and stability of silver powder determined the stacking structure of silver particles on the substrate,thus affecting the plating ability and peeling strength of the coating.