详细信息

Temperature-activated coupling effect of nano-Ag coupled ultrasonic transducer during heating process  ( SCI-EXPANDED收录 EI收录)  

文献类型:期刊文献

英文题名:Temperature-activated coupling effect of nano-Ag coupled ultrasonic transducer during heating process

作者:Gu, Yiqing[1];Wang, Mingyuan[1];Jia, Jiuhong[1];Tu, Shan-Tung[1]

机构:[1]East China Univ Sci & Technol, Key Lab Pressure Syst & Safety, Minist Educ, Shanghai 200237, Peoples R China

年份:2025

卷号:155

外文期刊名:ULTRASONICS

收录:;EI(收录号:20252618659217);WOS:【SCI-EXPANDED(收录号:WOS:001520325400001)】;

基金:The authors are grateful to the National Key Research and Devel-opment Project (No. 2023YFB3712100) and National Natural Science Foundation of China (Grant No. 52175138) for the financial support of this work.

语种:英文

外文关键词:Nano-Ag; LiNbO 3 piezoelectric wafer; High-temperature transducer

摘要:High-temperature ultrasonic transducers (HTUTs) are critical for structural health monitoring (SHM). While many existing studies on HTUTs prioritize maximizing operational temperatures or focus on singular highperformance piezoelectric materials or robust bonding techniques like brazing for extreme conditions, this work distinguishes itself by comprehensively investigating a synergistic, multi-component system specifically optimized for stable, well-characterized performance and revealing novel interfacial phenomena within the industrially prevalent 350 degrees C range. We introduce a HTUT innovatively constructed using a nano-Ag coupling layer, graphite conductive glue for reliable electrical contacts, and mica high-temperature wire. The transducer's performance and underlying mechanisms are systematically assessed from 20 degrees C to 350 degrees C. Results demonstrate exceptional high-temperature adaptability with stable echo characteristics. A primary distinguishing contribution is the identification and characterization of a "Temperature-Activated Coupling Effect". Unlike the monotonic performance degradation often anticipated or observed with increasing temperature in many systems, the Temperature-Activated Coupling Effect reveals a unique window where peak-to-peak voltage and SNR are enhanced after surpassing a specific thermal threshold. This phenomenon, attributed to thermally induced improvements at the nano-Ag coupling interface, offers novel insights for optimizing transducer performance. While the mechanical coupling coefficient showed a complex trend, peaking at 100 degrees C, the overall significance of this study lies in its holistic design approach and the elucidation of the Temperature-Activated Coupling Effect, offering a practical and mechanistically insightful advancement beyond simply achieving temperature tolerance. This provides a distinct pathway for developing HTUTs with tailored performance enhancements for moderately high-temperature SHM applications, contrasting with approaches solely focused on ultimate temperature limits or single-material improvements.

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