详细信息
含B-O-C动态可逆键的室温可降解环氧树脂的制备 ( EI收录)
Preparation of Room Temperature Degradable Epoxy Resins Containing B-O-C Dynamic Reversible Bonds
文献类型:期刊文献
中文题名:含B-O-C动态可逆键的室温可降解环氧树脂的制备
英文题名:Preparation of Room Temperature Degradable Epoxy Resins Containing B-O-C Dynamic Reversible Bonds
作者:方超宇[1];李鑫[1];尤立文[1];蒋峰光[1];刘敏[1];王芳[1];周权[1]
机构:[1]华东理工大学材料科学与工程学院特种功能高分子材料及相关技术教育部重点实验室,上海200237
年份:2022
卷号:38
期号:10
起止页码:23
中文期刊名:高分子材料科学与工程
外文期刊名:Polymer Materials Science & Engineering
收录:CSTPCD;;EI(收录号:20224913216014);Scopus;北大核心:【北大核心2020】;CSCD:【CSCD2021_2022】;
基金:中央高校基本科研业务费专项资金(50321042017001)。
语种:中文
中文关键词:环氧树脂;动态可逆;B-O-C键;可降解热固性树脂
外文关键词:epoxy resin;dynamic reversible;B-O-C bonding;degradable thermosets
摘要:采用两步法制备了一种无催化剂的含B-O-C动态可逆共价键的室温可降解环氧树脂(EDSPs)。首先用二氨基二苯砜(DDS)为扩链剂对双酚A型环氧树脂开环加成,制备含有大量羟基的扩链环氧体系(EDSs)。之后EDSs与苯硼酸(PBA)反应生成含B-O-C动态可逆共价键的EDSPs。通过红外光谱和核磁共振对EDSs和EDSPs进行了结构表征。通过差示扫描量热分析测得EDSPs的Tg高达194℃,热重分析测得EDSPs在氮气氛围下T为363.3℃,800℃的质量残留率为40.3%。此外,EDSPs具有良好的耐溶剂性和重塑性。EDSPs在室温下温和的乙醇中即可降解,降解后的EDSPs可以循环回收并二次制备动态可逆环氧体系(R-EDSPs)。
A catalyst-free room-temperature degradable epoxy resin(EDSPs) containing B-O-C dynamic reversible covalent bond was prepared by a two-step method. Firstly, a diaminodiphenyl sulfone(DDS) was used as chain extender for the ring-opening addition of bisphenol A epoxy resin to prepare chain-expanded epoxy systems(EDSs) containing a large number of hydroxyl groups. Secondly, the EDSs reacted with phenylboronic acid(PBA) to form EDSPs containing B-O-C dynamic reversible covalent bond. The EDSs and EDSPs were characterized by FT-IR and NMR. The Tgof EDSPs is found to be as high as 194 ℃ measured by DSC. TGA tests show that the Tof EDSPs is 363.3 ℃ and mass residual rate is 40.3% at 800 ℃ in nitrogen atmosphere. In addition, EDSPs are not only resistant to a wide range of solvents, but can be remoulded at high temperature after milling. EDSPs can degrade under mild ethanol conditions at room temperature. The degraded EDSPs can be recycled for the secondary preparation of dynamic reversible epoxy systems(R-EDSPs).
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