文献类型：期刊文献

英文题名：Dual-functional molecular engineering of silicon-alkyne polyimides: A novel strategy for balancing processability and thermal stability in high-performance composites

作者：Lv, Yizhe[1];Jin, Chaoen[1];Xia, Shiqi[1];Deng, Shifeng[1];Qi, Huimin[1]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Minist Educ, Key Lab Specially Funct Polymer Mat & Related Tech, Meilong Rd 130, Shanghai 200237, Peoples R China

年份：2025

卷号：37

期号：8-9

起止页码：453

外文期刊名：HIGH PERFORMANCE POLYMERS

收录：;EI(收录号：20253218945777);WOS:【SCI-EXPANDED(收录号:WOS:001525227300001)】；

基金：The authors disclosed receipt of the following financial support for the research, authorship, and/or publication of this article: This work was supported by the Key Laboratory of Specially Functional Polymeric Materials and Related Technology of Ministry of Education, East China University of Science & Technology, and the Fundamental Research Funds for the Central Universities (50321041918013 and 50321041917001).

语种：英文

外文关键词：polyimide; silicone-containing; processability; thermal stability

摘要：To address the poor processability of conventional aromatic polyimides while preserving their exceptional thermal properties, a novel diamine monomer, bis(m-aminophenylethynyl)dimethylsilane (SiMDA), was synthesized through a two-step reaction. Subsequently, SiMDA was copolymerized with 4,4 '-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 4-phenylethynylphthalic anhydride to yield a phenylethynyl-terminated polyimide (SiPI). The synergistic incorporation of silylmethyl (-Si(CH3)2-) and alkyne (-C equivalent to C-) moieties markedly enhanced the solubility of SiPI in low-boiling-point solvents (e.g., acetone, THF) and substantially lowered its melt viscosity (0.14 Pas at 184 degrees C). Notably, despite its improved processability, SiPI maintained outstanding thermal stability, exhibiting a 5% weight loss temperature (Td5) of 511 degrees C under nitrogen and a char yield of 63% at 800 degrees C. To evaluate the efficacy of this dual-functional design, two reference polyimides were synthesized for comparative analysis: one derived from 4,4 '-diaminodiphenyl ether (ODA) and the other from 2,2 '-bis(trifluoromethyl)diaminobiphenyl (TFMB). These comparisons underscore the distinctive advantages of SiMDA in achieving an optimal balance between processability and thermal stability. Furthermore, quartz fiber-reinforced SiPI composites demonstrated superior high-temperature mechanical performance, retaining 78.63% of their bending strength (285.00 MPa) and 67.89% of their interlayer shear strength (23.02 MPa) at 300 degrees C. This study not only proposes a molecular engineering strategy to reconcile the trade-off between processability and thermal stability in polyimides but also expands their potential for high-temperature applications in aerospace, microelectronics, and other advanced fields.