文献类型：期刊文献

英文题名：Facile fabrication and low-temperature bonding of Cu@Sn-Bi core-shell particles for conductive pastes

作者：Yang, Zhehan[1];Pan, Yi[1];Zhao, Hengyu[1];Yang, Xiangmin[1];Liang, Ying[1];Zhang, Zhen[1];Fang, Bin[1]

机构：[1]East China Univ Sci & Technol, Sch Sci, Inst Nucl Technol & Applicat, Shanghai 200237, Peoples R China

年份：2021

卷号：11

期号：42

起止页码：26408

外文期刊名：RSC ADVANCES

收录：;EI(收录号：20213210734830);WOS:【SCI-EXPANDED(收录号:WOS:000680655300062)】；

语种：英文

外文关键词：Binary alloys - Bismuth alloys - Shells (structures) - Temperature - Tin alloys - Copper - Wearable technology - Substrates - Flexible electronics

摘要：The rapid development of flexible wearable electronics arouses huge demand for low-temperature sintering metal inks applied to temperature-sensitive substrates. The high sintering temperature and easy oxidation limited the application of Cu-based pastes. A two-step method involving liquid co-reduction and heat ripening was developed to synthesize Cu@Sn-Bi core-shell particles. The thickness of Sn-Bi shells can be flexibly adjusted via changing the mass ratio of Cu to Sn-Bi. The volume resistivity of printed circuits using Cu@Sn-Bi pastes solidified at 200 degrees C was as low as 481 mu omega cm, which increased by 11.8% after an aging process at 190 degrees C for 6 h. The outstanding stability in a harsh environment would attribute to the effective protection of Sn-Bi alloy shells. This work suggests a new pathway toward the low-temperature bonding and anti-oxidation of Cu particles as conductive fillers, which can be widely applied to the additive manufacturing of flexible wearable electronics.