文献类型：期刊文献

英文题名：A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

作者：Yao, Xingjun[1]; Jiang, Weijie[1]; Yang, Jiahui[1]; Fang, Junjie[1]; Zhang, Wenjun[2]

机构：[1] School of Mechanical and Power Engineering, East China University of Science and Technology, Shanghai, 200237, China; [2] Department of Mechanical Engineering, University of Saskatchewan, Saskatoon, SK, S7N 5A9, Canada

年份：2021

卷号：144

期号：4

外文期刊名：Journal of Electronic Packaging

收录：EI(收录号：20221311860311)

语种：英文

外文关键词：Analytical models - Chip scale packages - Computational fluid dynamics - Flip chip devices - Soldering

摘要：This paper presents a new approach to formulating an analytical model for the underfill process in flip-chip packaging to predict the flow front and the filling time. The new approach is based on the concept of surface energy along with the energy conservation principle. This approach avoids the need of modeling the flow path to predict the flow front and the filling time, and thus it is suitable to different configurations of solder bumps, including different shapes and arrangements of solder bumps in flip-chip packaging. An experiment along with the computational fluid dynamics simulation was performed based on a proprietarily developed testbed to verify the effectiveness of this approach. Both the experimental and simulation results show that the proposed approach along with its model is accurate for flip-chip packages with different configurations besides the configuration of a regular triangle arrangement of solder bumps and a spher-ical shape of the solder bump. ? 2021 by ASME.