文献类型：专利

英文题名：Thin film thermoelectric semiconductor material seebeck coefficient testing method, involves processing thin film thermoelectric material using EMF signal, and sending digital signal to computer by data collecting module

作者：LUAN W;WANG W;WANG T

机构：[1]UNIV EAST CHINA SCI & TECHNOLOGY

申请号：CN103901071-B

公开日：2016-12-28

语种：英文

收录：DERWENT

摘要：NOVELTY - The method involves controlling an end mold by a heating device. A computer is connected with a data collecting module. A thin film thermoelectric material is processed using a temperature difference EMF signal. The heating device is connected with a strip-shaped ceramic heating sheet that is provided with a high temperature end and a low temperature end. The heating device is provided with an adjustable constant current source module. The ceramic heating sheet is connected with an electric current supply module. The data collecting module sends a digital signal to the computer. USE - Thin film thermoelectric semiconductor material seebeck coefficient testing method. ADVANTAGE - The method enables avoiding material edge effect and sampling point measuring error. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a thin film thermoelectric semiconductor material seebeck coefficient testing device. DESCRIPTION OF DRAWING(S) - The drawing shows a top sectional perspective view of a thin film thermoelectric semiconductor material seebeck coefficient testing device.