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New naphthalimide-quaternary ammonium compounds useful as acid copper plating (copper sulfate plating solution) leveler    

文献类型:专利

英文题名:New naphthalimide-quaternary ammonium compounds useful as acid copper plating (copper sulfate plating solution) leveler

作者:CHEN L;CHEN B;HUANG Z;WANG G;XU J;TIAN H;WANG F;WANG L;WU S;WU Y;WANG Z

机构:[1]UNIV EAST CHINA SCI & TECHNOLOGY;[2]BAIHEHUA GROUP CO LTD;[3]UNIV EAST CHINA SCI & TECHNOLOGY;[4]BAIHEHUA GROUP CO LTD

申请号:CN105646346-A

申请日:2015-12-25

公开日:2016-06-08

语种:英文

收录:DERWENT

摘要:NOVELTY - Naphthalimide-quaternary ammonium compounds (I) are new. USE - (I) are useful as acid copper plating (copper sulfate plating solution) leveler (claimed). DETAILED DESCRIPTION - Naphthalimide-quaternary ammonium compounds of formula (I) are new. R1, R2 = 1-6C alkyl, 1-6C haloalkyl or quaternary ammonium group of formula (II); X = O or NR6; n = 1 or 2; A = halo; Z = methylene or O; R3-R5 = 1-4C alkyl; R6 = H or 1-4C alkyl; a = 1-20; and b = 0-20. Provided that: At least one of R1 and R2 is (II).

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