文献类型：期刊文献

中文题名：低共熔点芳胺固化聚醚砜增韧环氧树脂动力学

英文题名：Kinetics of eutectic aromatic amine curing poly(ether sulfone) toughened epoxy resin

作者：沈康[1];周权[1];倪礼忠;钱建华[2];刘坐镇[2]

机构：[1]华东理工大学材料科学与工程学院特种功能高分子材料及相关技术教育部重点实验室,上海200237;[2]华东理工大学华昌聚合物有限公司上海防腐蚀新材料工程技术研究中心,上海200237

年份：2015

卷号：30

期号：6

起止页码：17

中文期刊名：热固性树脂

外文期刊名：Thermosetting Resin

收录：CSTPCD;;北大核心:【北大核心2014】；CSCD:【CSCD2015_2016】；

基金：上海市重大科技攻关项目(12dz1100404)资助

语种：中文

中文关键词：低共熔点芳胺固化剂;环氧树脂;聚醚砜;4,4′-二氨基二苯甲烷;固化动力学

外文关键词：eutectic aromatic amine curing agent;;epoxy resins;;polyether sulfone;;4,4′-diaminodiphenylmethane;;curing kinetics

摘要：以间苯二胺(MPD)、4,4′-二氨基二苯基甲烷(DDM)共混制备了一种低共熔点的芳胺固化剂(M3)。通过示差扫描量热分析研究了聚醚砜(PES)增韧环氧树脂(TDE-85)与M3体系的固化行为,根据Kissinger方法和Crane方法确定了体系的固化动力学模型及固化动力学参数。结果表明:当MPD的质量分数为30%时,可形成共熔物(M3),熔融温度为36.6℃。TDE-85/M3/PES体系的固化动力学模型符合n级固化反应方程,其表观活化能ΔE为48.56 k J/mol,反应级数n为0.87。此外,利用外推法得到体系起始固化温度Tgel=107℃,恒温固化温度Tcure=137℃,后处理温度Ttreat=159℃。
The eutectic aromatic amine curing agent(M3)was prepared by blending m-phenylenediamine(MPD)and 4,4′- diaminodiphenyl methane(DDM). The curing behaviors of polyether sulfone(PES)toughened epoxy(TDE-85)and M3 system were investigated by differential scanning calorimetry analysis. The curing kinetics model and parameters of the system were determined according to the Kissinger method and Crane methods. The results showed that the M3 could be formed when the MPD mass fraction was30% and the melting temperature was 36.6 ℃. The curing kinetics model of TDE-85/M3/PES system was in line with n-stage curing reaction equation. The apparent activation energy ΔE was 48.56 k J/mol and reaction order n was 0.87. In addition,the start curing temperature Tgel,constant curing temperature Tcureand post-treatment temperature Ttreatof the system were obtained by extrapolation method and they were 107 ℃,137 ℃ and 159 ℃,respectively.