文献类型：期刊文献

中文题名：基于多孔结构的微通道散热技术研究现状

英文题名：Research Status of Microchannel Heat Dissipation Technology Based on Porous Structure

作者：周雄[1];张莉[1]

机构：[1]华东理工大学机械与动力工程学院,上海200237

年份：2025

卷号：46

期号：2

起止页码：17

中文期刊名：制冷学报

外文期刊名：Journal of Refrigeration

收录：;北大核心:【北大核心2023】；

基金：国家自然科学基金(51776074)资助项目。

语种：中文

中文关键词：微通道散热器;多孔结构;传热强化;压降;优化设计

外文关键词：microchannel heat sink;porous structure;heat transfer enhancement;pressure drop;optimal design

摘要：随着微电子器件的飞速发展,电子设备越来越倾向于小型轻量化、高集成度、高热流密度的方向发展。多孔结构因其能有效拓展传热面积、增加汽化核心和调控壁面润湿性而强化沸腾传热,广泛应用于散热领域。基于多孔结构的微通道散热技术是提高散热器性能十分有效且极具发展前景的方法。微通道表面多孔结构、微通道内填充多孔材料和微通道骨架为多孔结构是近年来3种常见的多孔结构和微通道相结合增强沸腾传热的结构形式,多孔结构主要包括多孔涂层、微腔、金属泡沫、多孔翅片和多孔肋等。主要对近年来基于多孔结构的微通道散热技术的研究进展进行了综述,对比分析了上述3种强化传热结构的优缺点,阐述了微通道散热器在传热性能和压降的平衡设计方面所面临的问题,并提出了相关的优化设计方法。
The rapid development of microelectronic devices has driven a trend toward miniaturized and lightweight electronic devices with high heat flux.Porous structures are increasingly used in heat dissipation due to their ability to expand the heat transfer area,enhance nucleation sites for boiling,and regulate surface wettability,significantly improving boiling heat transfer.Microchannel heat dissipation technology based on porous structures has emerged as an effective and promising method to enhance heat sink performance.Recent advancements highlight three common configurations:porous structures on microchannel surfaces,porous materials within microchannels,and porous microchannel skeletons.These structures encompass coatings,microcavities,metal foams,porous fins,and ribs.This article reviews progress in microchannel heat dissipation using porous structures,evaluates the benefits and drawbacks of these configurations,addresses challenges such as balancing heat transfer and pressure drop,and proposes optimization strategies to overcome these issues.