文献类型：期刊文献

英文题名：Diketopyrrolopyrrole-based supramolecular nano-leveler for the enhancement of conformal copper electrodeposition

作者：Li, Jun[1,2];Xu, Jie[1,2];Wang, Xiaomin[1,2];Wei, Xiaochuan[1,2];Wang, Limin[1,2,3]

机构：[1]East China Univ Sci & Technol, Shanghai Key Lab Funct Mat Chem, Sch Chem & Mol Engn, 130 Meilong Rd, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Inst Fine Chem, Sch Chem & Mol Engn, 130 Meilong Rd, Shanghai 200237, Peoples R China;[3]Chinese Acad Sci, Shanghai Inst Organ Chem, Key Lab Organofluorine Chem, 345 Lingling Rd, Shanghai 200032, Peoples R China

年份：2021

卷号：569

外文期刊名：APPLIED SURFACE SCIENCE

收录：;EI(收录号：20213510838086);WOS:【SCI-EXPANDED(收录号:WOS:000722275600002)】；

基金：This research was financially supported by the National Nature Science Foundation of China(21772039, 21272069), and we gratefully acknowledge financial support from the Central Universities and Key Laboratory of Organofluorine Chemistry, Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences. Support from the Chinese Scholarship Council is also acknowledged.

语种：英文

外文关键词：Supramolecular nano-leveler; Diketopyrrolopyrrole; Cucurbit[7]uril; Copper electrodeposition

摘要：Diketopyrrolopyrrole (DPP) quaternary ammonium compound is an excellent leveler for the copper electrode position. Herein, we propose a supramolecular nano-leveler based on DPP molecule, which is composed of a symmetrical amphiphilic molecule of bipyridinium (Bpy) units grafted on DPP skeleton and assembled with cucurbit[7]uril (CB[7]). Compared with unassembled levelers, this supramolecular leveler shows significant advantages in achieving conformal copper electrodeposition. DFT calculations and molecular dynamics simulations demonstrate that the CB[7] assembled strategy can increase the charge density of nano-leveler and lead to the strong adsorption on the surface of substrate, thus efficiently regulating the copper deposition process. As a result, the solution implement of 2 mu mol/L nano-leveler and other additives achieves excellent bottom-up filling performance, accompanying by a high filling efficiency of 97.7%. This supramolecular assembled strategy of leveler may open up a new avenue for the interfaces engineering of organics for semiconductor fabrication.