文献类型：期刊文献

中文题名：次亚磷酸钠体系化学镀镍沉积机理探讨

英文题名：The Mechanism of Electroless Nickel Deposition in Sodium Hypophosphite Bath

作者：刘永健[1];王印培[1]

机构：[1]华东理工大学化工机械研究所,上海200237

年份：2001

卷号：27

期号：3

起止页码：301

中文期刊名：华东理工大学学报（自然科学版）

外文期刊名：Journal of East China University of Science and Technology

收录：CSTPCD;;Scopus;北大核心:【北大核心2000】；CSCD:【CSCD2011_2012】；

语种：中文

中文关键词：化学镀镍;次亚磷酸钠;沉积机理;耐蚀性;沉积速度;微观形貌;成分均匀性

外文关键词：eletroless nickel plating; sodium hypophosphite; deposition mechanism; corrosion resistant

摘要：探讨了次亚磷酸钠体系化学镀镍沉积机理。认为镀层的微观形貌和成分均匀性与镀层“沉积表面”和“镀层锋线”的镍离子活度密切相关。指出采用混合配体可降低“H- P”均裂所需要的能量 ,有利于镀层以锋线推进的层片状方式生长 ,提高镀层的耐蚀性 ;镀液中添加适量稀土 ,增加催化表面的活性点数目 ,加快镍离子被还原过程中电子传递速度 。
The mechanism of electroless nickel deposition in sodium hypophosphite bath is discussed. It is assumed that the microscopic shape and ingredient homogeneousness of deposition depends on the local nickel effective content near the deposit surface and deposition front. It is suggested that the adoption of mixing complexions can lower the energy required by the homolysis of “H P” band, favorable to the growth of deposition by synusia like model. Small amount of rare earth element added in eletrolyte can enhance the depositing rates and corrosion resistant of deposition by increasing the number of the active spots in nickel surface and the rates of electron transfers in reaction.