文献类型：会议论文

英文题名：Study on the characteristics of centrifugal separation process of the solder on the waste printed circuit boards

作者：Wang, R. X.[1];Zhou, X. T.[1];Xing, X. Y.[1];Wan, X. H.[1]

机构：[1]East China Univ Sci & Technol, Inst Chem Machinery, Shanghai, Peoples R China

会议论文集：International Conference on Water Resources and Environment (WRE)

会议日期：JUL 25-28, 2015

会议地点：Beijing, PEOPLES R CHINA

语种：英文

外文关键词：Printed Circuit Boards; solder; centrifugal separation; Critical Separation Radius

摘要：With the rapid development of the electronic industry, an increasing number of Waste Printed Circuit Boards (WPCBs) are discarded. WPCBs contain lots of valuable resources and plenty of hazardous materials, which will cause serious environmental contaminant if handled clumsily. The paper proposed a new technology and device to separate and recycle the solder from the WPCBs. It derived the minimum separation radius of the solder separating from the PCBs through the theoretical analysis and put forward the concept of the Critical Separation Radius. Then it researched the influence of the time, rotating speed and the temperature on the Critical Separation Radius. In the end, the Critical Separation Radius under different operation condition was obtained. This study offers a new clean and non-polluting technology to recycle solder from WPCBs and prevents the environmental pollution by WPCBs effectively.