文献类型：期刊文献

英文题名：A New Analysis of the Capillary Driving Pressure for Underfill Flow in Flip-Chip Packaging

作者：Yao, Xing Jun[1];Wang, Zheng Dong[2];Zhang, Wen Jun[2,3]

机构：[1]E China Univ Sci & Technol, Sch Mech & Power Engn, Dept Mat & Equipment Engn, Shanghai 200237, Peoples R China;[2]E China Univ Sci & Technol, Complex & Intelligent Syst Res Lab, Shanghai 200237, Peoples R China;[3]Univ Saskatchewan, Dept Mech Engn, Saskatoon, SK S7N 5A1, Canada

年份：2014

卷号：4

期号：9

起止页码：1534

外文期刊名：IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

收录：;EI(收录号：20143600014788);WOS:【SCI-EXPANDED(收录号:WOS:000341985900015)】；

基金：This work was supported in part by the 1000's Talent Fund and in part by the Central University Fund, East China University of Science and Technology, Shanghai, China. Recommended for publication by Associate Editor E. D. Perfecto upon evaluation of reviewers' comments. (Corresponding author: Wen Jun Zhang.)

语种：英文

外文关键词：Capillary force; flip chip; fluid-solid interaction; modeling; underfill flow

摘要：Control of the capillary driven underfill flow process is a very important problem in flip chip technology in electronics packaging. The challenge here is to uniformly distribute fluids in the gap, which is composed of the chip and substrate and solder bumps. In this paper, we first present a conceptual model of the flow behavior of underfill materials, which has four stages, leading to the finding that the contact line jump phenomenon occurs at both entry and exit of the solder bumps. We then propose a more accurate model for describing the flow front based on the principles of mass conservation and force equilibrium. Another contribution of the present paper is the proposal of a computational model for describing the average capillary pressure difference with respect to the area of flow. The verification of these models is presented by comparing the result calculated with our model with the experimental result reported in the literature, which shows the superiority of the models proposed in this paper.