文献类型：期刊文献

英文题名：Dynamic networks for polyimine with disulfide bond to obtain catalyst-free recyclability, multi-degradation and malleability

作者：Zhang, Wenhua[2];Zhou, Quan[1];Fang, Chaoyu[1];You, Liwen[1];Li, Xin[1];Liu, Min[1];Dong, Xiao[1];Qi, Yiqing[1];Wang, Bozheng[1];Li, Wentao[1]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Key Lab Specially Funct Polymer Mat & Related Tec, Shanghai 200237, Peoples R China;[2]Shanghai Composite Mat Technol Co Ltd, Shanghai 200237, Peoples R China

年份：2022

卷号：29

期号：5

外文期刊名：JOURNAL OF POLYMER RESEARCH

收录：;EI(收录号：20221411920746);WOS:【SCI-EXPANDED(收录号:WOS:000777994200001)】；

基金：This work was supported by the Fundamental Research Funds for the Central Universities.

语种：英文

外文关键词：Degradation; Thermoset; Dynamic covalent bond; Recyclable

摘要：The three dimensional network of traditional thermosetting resin not only endows it with good properties but also brings the challenge to degrade. Nowadays, except for introducing the dynamic covalent bond into the traditional polymer chain, the novel thermosetting resin owning dynamic bond in itself is also preferred. In this paper, a novel thermosetting resin constructed with two dynamic covalent bonds was synthesized. The strategy of multiple dynamic covalent bonds in one kind of resin can not only increase the variety of thermosetting resin greatly but also exploit this to possess more degradation methods and improve the property of resin to satisfy our requirements. Firstly, the prepolymer containing disulfide bond and acetal dynamic covalent network (DCNSA) was synthesized by the reaction between 4,4-dithiodiphenylamine (AFD) and paraformaldehyde (PFA) at room temperature. Then it was cured by temperature programming. A similar method was applied to prepare 4-diaminodiphenylmethane (DDM) and paraformaldehyde (PFA) for comparision. Then properties of prepolymer and cured resin were characterized in detail, which manifested that two dynamic covalent bonds in AFD/DCNSA thermosetting resin endow it with a variety of degradation modes, while maintaining good heat resistance and solvent resistance; in addition, the reshaping experiment revealed the cured resin could be reprocessed.