文献类型：期刊文献

中文题名：Rigid Biphenyl-contained Epoxy Resins with Improved Thermal Resistant Properties

英文题名：Rigid Biphenyl-contained Epoxy Resins with Improved Thermal Resistant Properties

作者：Xiao-yan Wei[1];Bo-xuan Zhao[2];尚亚卓[1];程元荣[3]

机构：[1]Key Laboratory for Advanced Materials, School of Chemistry & Molecular Engineering, East China University of Science and Technology;[2]Shanghai Wujing Optoelectronics Sci&Tech Co., Ltd;[3]Department of Materials Science, Fudan University

年份：2017

卷号：35

期号：11

起止页码：1428

中文期刊名：Chinese Journal of Polymer Science

外文期刊名：高分子科学（英文版）

收录：CSTPCD;;Scopus;CSCD:【CSCD2017_2018】；

基金：financially supported by the National Natural Science Foundation of China(Nos.51403039 and 21476072);the Natural Science Foundation of Shanghai(No.13ZR1451300)

语种：中文

中文关键词：Epoxy resin; Hydrosilylation; Biphenyl group; Thermal property; Crosslinking density

外文关键词：Epoxy resin; Hydrosilylation; Biphenyl group; Thermal property; Crosslinking density

摘要：Biphenyl-contained monomer of 1,4-bis[2-（3,4-epoxy cyclohexyl ethyl） dimethylsilyl] biphenyl （BP-SiH-EP） was prepared via hydrosilylation reaction of 1,4-bis（dimethylsilyl） biphenyl （BP-SiH） and 1,2-epoxy-4-vinylcyclohexane in the presence of Karstedt＇s catalyst. ^1H-NMR, 13C-NMR and FTIR were used to characterize the structure of the obtained monomer. BP-SiH-EP was then cured by methyl hexahydrophthalic anhydride （MeHHPA） with 1-cyanoethyl-2-ethyl-4- methylimidazole as an accelerator. The polymerization behavior was studied by DSC. The results of DMA measurement demonstrate that the cured BP-SiH-EP/MeHHPA can maintain high storage modulus （〉1 GPa） in a wide range of temperature up to 176 ℃. According to the damping factor curve of DMA, cured BP-SiH-EP/MeHHPA exhibits a high glass transition temperature （Tg） of 192 ℃, which is 20 ℃ higher than that of cured 1,4-bis[2-（3,4-epoxy cyclohexyl ethyl） dimethylsilyl] benzene （DEDSB）/MeHHPA. TGA results show that cured BP-SiH-EP/MeHHPA has good thermal stability （Tso/o = 339 ℃） due to the high heat-resistance of rigid biphenyl group. Moreover, the crosslinking density of cured BP-SiH-EP/MeHHPA should be lower than that of cured DEDSB/MeHHPA estimated from their chemical structures, which conflicts with the calculated results based on the rubber elasticity equation. The inconsistence indicates that the calculated crosslinking densities are not comparable, possibly owing to their differences in the rigidity of polymer chains and intermolecular interaction.
Biphenyl-contained monomer of 1,4-bis[2-（3,4-epoxy cyclohexyl ethyl） dimethylsilyl] biphenyl （BP-SiH-EP） was prepared via hydrosilylation reaction of 1,4-bis（dimethylsilyl） biphenyl （BP-SiH） and 1,2-epoxy-4-vinylcyclohexane in the presence of Karstedt＇s catalyst. ^1H-NMR, 13C-NMR and FTIR were used to characterize the structure of the obtained monomer. BP-SiH-EP was then cured by methyl hexahydrophthalic anhydride （MeHHPA） with 1-cyanoethyl-2-ethyl-4- methylimidazole as an accelerator. The polymerization behavior was studied by DSC. The results of DMA measurement demonstrate that the cured BP-SiH-EP/MeHHPA can maintain high storage modulus （〉1 GPa） in a wide range of temperature up to 176 ℃. According to the damping factor curve of DMA, cured BP-SiH-EP/MeHHPA exhibits a high glass transition temperature （Tg） of 192 ℃, which is 20 ℃ higher than that of cured 1,4-bis[2-（3,4-epoxy cyclohexyl ethyl） dimethylsilyl] benzene （DEDSB）/MeHHPA. TGA results show that cured BP-SiH-EP/MeHHPA has good thermal stability （Tso/o = 339 ℃） due to the high heat-resistance of rigid biphenyl group. Moreover, the crosslinking density of cured BP-SiH-EP/MeHHPA should be lower than that of cured DEDSB/MeHHPA estimated from their chemical structures, which conflicts with the calculated results based on the rubber elasticity equation. The inconsistence indicates that the calculated crosslinking densities are not comparable, possibly owing to their differences in the rigidity of polymer chains and intermolecular interaction.