详细信息
含硅芳炔树脂的固化及其复合材料性能
Curing Process of Silicon-containing Polyarylethylene and Properties of Its Composite
文献类型:期刊文献
中文题名:含硅芳炔树脂的固化及其复合材料性能
英文题名:Curing Process of Silicon-containing Polyarylethylene and Properties of Its Composite
作者:杨丽[1];沈烨[1];袁荞龙[1];黄发荣[1];杜磊[1]
机构:[1]华东理工大学材料科学与与工程学院,特种功能高分子材料及相关技术教育部重点实验室,上海200237
年份:2015
卷号:48
期号:3
起止页码:18
中文期刊名:绝缘材料
外文期刊名:Insulating Materials
收录:CSTPCD;;北大核心:【北大核心2014】;
基金:上海市重点学科资助项目(B502)
语种:中文
中文关键词:含硅芳炔树脂;催化;固化;热性能;弯曲性能
外文关键词:silicon-containing polyarylethylene;catalyst;curing;thermal property;flexural property
摘要:通过溶液法在含硅芳炔树脂(PSA)中加入催化剂乙酰丙酮镍和三苯基膦,制备了碳纤维增强PSA复合材料(T700CF/PSA),研究PSA树脂的热自聚固化和催化固化反应动力学、固化树脂的热性能和复合材料的弯曲性能。结果表明:PSA中加入催化剂可降低其固化温度,初始表观活化能下降,但后期固化表观活化能提高。加入催化剂后的PSA的热稳定性略高于未加催化剂的PSA,800℃氮气氛围中残留率达88%。单向碳纤维T700CF增强PSA基复合材料室温下的弯曲强度为1805 MPa,弯曲模量为149 GPa,300℃下弯曲强度和弯曲模量的保留率分别为73%和93%,其玻璃化转变温度高于500℃。T700CF增强含催化剂的PSA基复合材料的弯曲模量提高,但室温下弯曲强度略有降低。
A carbon fiber(CF)reinforced silicon-containing polyarylethylene(T700CF/PSA)composite was prepared by adding nickel acetylacetonate and triphenylphosphine catalyst in the PSA solution through solution method.The curing kinetics of PSA with catalyst and catalyst-free,the thermal property of the cured PSA,and the flexural property of the T700CF/PSA composite were studied.The results show that the addition of catalyst could make the curing temperature of PSA and its apparent active energy(Ea)in the early curing stage decrease,but its Eain the late curing stage increase.The thermal stability of the catalyst-added PSA is little higher than that of the catalyst-free PSA,and its residue rate in N2attains88%.The flexural strength and modulus of the T700CF/PSA composite at room temperature are 1805 MPa and 149 GPa,the retention rate of flexural strength and modulus at 300℃are 73%and 93%,respectively,and its glass transition temperature is higher than 500℃.The flexural modulus of T700CF/PSA composite with catalyst increases,but its flexural strength at room temperature decreases a little.
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