文献类型：期刊文献

英文题名：Pulse current electrodeposition of Al from an AlCl3-EMIC ionic liquid

作者：Li, Bing[1]; Fan, Chunhua[1]; Chen, Yan[1]; Lou, Jingwei[1]; Yan, Lingguang[1]

机构：[1] School of Resource and Environmental Engineering, East China University of Science and Technology, 130 Meilong Road, Shanghai 200237, China

年份：2011

卷号：56

期号：16

起止页码：5478

外文期刊名：Electrochimica Acta

收录：EI(收录号：20112314029586)

语种：英文

外文关键词：Electrodes - Plating - Aluminum chloride - Lanthanum compounds - Electrodeposition - Grain size and shape - Aluminum coatings - Deposits

摘要：Electrodeposition of aluminum from an AlCl3-EMIC ionic liquid with or without the addition of saturated LaCl3 was carried out by both direct- and pulse-current plating methods. The effects of various parameters, including current density, pulse frequency, current on/off duration (ton and toff), and temperature, on deposit morphology and crystal size were investigated. Deposits prepared by pulse-current plating gave a brighter and flatter surface than those prepared by direct-current plating at appropriate pulse current parameters. Temperature and pulse-current frequency (toff) were shown to significantly affect deposit morphology. Coalescence of grains during toff periods in the pulse current plating was observed, especially at temperatures above 60 °C. Increasing the temperature from 25 to 90 °C caused an increase in deposit grain size and resulted in a change of grain shapes from a small sphere-like form to a feather-like form. As a result, the adhesion of the deposited aluminum to the substrate was lowered. Smaller grain sizes and well-adhered deposits were achieved at lower temperatures. For example, deposition at 25 °C resulted in the smallest crystal size of about 0.3 μm under the conditions of t on = 80 ms, toff = 20 ms, and i = 8 mA/cm2. Furthermore, the addition of LaCl3 to the melt at 60 °C effectively reduced the porosity and improved compactness of deposits. ? 2011 Elsevier Ltd. All rights reserved.