文献类型：期刊文献

英文题名：Influence of branched quaternary ammonium surfactant molecules as levelers for copper electroplating from acidic sulfate bath

作者：Wang, An-yin[1];Chen, Biao[1];Fang, Lei[1];Yu, Jian-jun[1];Wang, Li-min[1,2]

机构：[1]E China Univ Sci & Technol, Inst Fine Chem, Shanghai Key Lab Funct Mat Chem, Shanghai 200237, Peoples R China;[2]Chinese Acad Sci, Shanghai Inst Organ Chem, Key Lab Organofluorine Chem, Shanghai 200032, Peoples R China

年份：2013

卷号：108

起止页码：698

外文期刊名：ELECTROCHIMICA ACTA

收录：;EI(收录号：20134016793640);WOS:【SCI-EXPANDED(收录号:WOS:000328014000091)】；

基金：This work was financially supported by the National Nature Science Foundation of China (NSFC 20672035 and 21272069), the Fundamental Research Funds for the Central Universities and Key Laboratory of Organofluorine Chemistry, Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences.

语种：英文

外文关键词：Copper electroplating; Branched molecule; Quaternary ammonium surfactant; Leveler

摘要：A family of branched quaternary ammonium surfactants (compounds 1a-1c) with different carbon chains were synthesized for levelers applied in copper electroplating. Their inhibitory actions on copper electroplating were characterized by cyclic voltammetry (CV). Compound 1b, as representative structure type, was tested by means of different electrochemical methods including CV, polarization curve and electrochemical impedance spectroscopy (EIS) with different concentrations. The interaction between compound 1b and copper surface was investigated using atomic force microscope (AFM) and X-ray photoelectron spectra (XPS). The results indicated that our newly synthesized compounds, particular 1b, were effective levelers used for copper electroplating. Compound 1b could adsorb on copper surface to form an adsorption layer. The adsorption behavior of compound 1b on copper surface indicated that compound 1b could inhibit the copper electrodeposition, which provided favorable conditions used as a leveler. Moreover, the addition of compound 1b could increase the cathodic polarization, which was attributed to the adsorption of compound 1b during copper electroplating process. In addition, various surface morphologies and crystalline orientation of the plated copper films caused by different concentrations of compound 1b were characterized by scanning electron microscope (SEM) and X-ray diffraction (XRD) respectively. Effects of compound 1b on refining the grain size and changing the preferential orientation of the plated copper films were exhibited. Crown Copyright (C) 2013 Published by Elsevier Ltd. All rights reserved.