文献类型：期刊文献

英文题名：Aryl modification of diketopyrrolopyrrole-based quaternary ammonium salts and their applications in copper electrodeposition

作者：Xu, Jie[1,2];Chen, Biao[3];Lv, Jinge[3];Chang, Dongdong[3];Niu, Dongfang[1,2];Hu, Shuozhen[1,2];Zhang, Xinsheng[1,2];Xin, Zhong[1,2];Wang, Limin[3]

机构：[1]East China Univ Sci & Technol, State Key Lab Chem Engn, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Sch Chem Engn, Shanghai 200237, Peoples R China;[3]East China Univ Sci & Technol, Sch Chem & Mol Engn, Inst Fine Chem, Key Lab Adv Mat, 130 Meilong Rd, Shanghai 200237, Peoples R China

年份：2019

卷号：170

外文期刊名：DYES AND PIGMENTS

收录：;EI(收录号：20192106954969);WOS:【SCI-EXPANDED(收录号:WOS:000478711200015)】；

基金：This research was financially supported by the National Natural Science Foundation of China of China (21772039, 21272069), National Key Research and Development Program of China (Grant NO. 2017YFB0307500 and Grant NO. 2017YFB0307502), the 111 Project of China (No. B08021) and the collaborative Innovation centre for Petrochemical New materials, Anqing, Anhui 246011, P.R. China. Shanghai Pujiang Prograrn (N;o. 18PJ14020000) and Fundamental Research Funds for the Central Universities and Key Laboratory of Organofluorine Chemistry, Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences. We thank helpful discussion from Dr. Xian-Yu Song for the molecule dynamic simulations.

语种：英文

外文关键词：Diketopyrrolopyrrole; Leveler; Copper electrodeposition; Theoretical calculations

摘要：Diketopyrrolopyrrole (DPP), as a brilliant functional organic pigments, is an excellent candidate to be used for leveler in copper electrodeposition. Herein, the DPP derivatives with different aryl substitutions are conveniently designed, synthesized and used as levelers in copper electrodeposition. The molecules based on DPP skeleton are investigated the structure-performance relationships by featuring aryl substitutions with different electronic properties. The results indicate that the aryl modification of DPP plays an important role in tunning the surface activity, interface adhesion and the interaction with copper surface. The admirable synergistic effect of CF3-DPP with bis-(3-sulfopropyl) disulfide (SPS) and polyethylene glycol (PEG) leads to an excellent conformal copper deposition during practical electroplating. Theoretical calculations show that the aryl modification also tunes the molecular orbital energy level and adsorption energy of DPP toward copper surface. This work provides a guiding significance in the design of efficient dye-based levelers for microelectronics copper electrodeposition.