文献类型：期刊文献

英文题名：Novel 2,5-bis(6-(trimethylamonium)hexyl)-3,6-diaryl-1,4-diketopyrrolo [3,4-c]pyrrole pigments as levelers for efficient electroplating applications

作者：Li, Jun[1,2];Xu, Jie[1,2];Wang, Xiaomin[1,2];Wei, Xiaochuan[1,2];Lv, Jinge[1,2];Wang, Limin[1,2,3]

机构：[1]East China Univ Sci & Technol, Sch Chem & Mol Engn, Shanghai Key Lab Funct Mat Chem, 130 Meilong Rd, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Sch Chem & Mol Engn, Inst Fine Chem, 130 Meilong Rd, Shanghai 200237, Peoples R China;[3]Chinese Acad Sci, Shanghai Inst Organ Chem, Key Lab Organofluorine Chem, 345 Lingling Rd, Shanghai 200032, Peoples R China

年份：2021

卷号：186

外文期刊名：DYES AND PIGMENTS

收录：;EI(收录号：20205209671097);WOS:【SCI-EXPANDED(收录号:WOS:000603547900008)】；

基金：This research was financially supported by the National Nature Science Foundation of China (21772039, 21272069), and we gratefully acknowledge financial support from the Central Universities and Key Laboratory of Organofluorine Chemistry, Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences. Support from the Chinese Scholarship Council is also acknowledged.

语种：英文

外文关键词：Diketopyrrolopyrrole derivative; Leveler; Copper electrodeposition; Filling performance

摘要：2,5-Bis(6-(trimethylamonium)hexyl)-3,6-diaryl-1,4-diketopyrrolo [3,4-c]pyrrole (DPP) pigments are excellent choices as levelers for copper electrodeposition. Herein, novel 4-methoxylaryl (1b) and 4-trifluoromethoxyaryl (1d) diketopyrrolopyrrole-based levelers were synthesized and the inhibitory ability of these levelers is evaluated by electrochemical measurements on copper electrodeposition which were compared with 4-methylaryl (1a) and 4-trifluoromethylaryl (1c) diketopyrrolopyrrole-based levelers. To investigate interactions between metal surface and additives, quantum chemical calculations and molecular dynamics simulations were used. Among them, the 4-trifluoromethoxy-DPP (1d) showed optimal inhibition and strong adsorption capacity on the copper surface. Then, as the representative leveler, 1d was selected for the systematic study of the leveling influence during microvia filling. Notably, 1d has achieved the bottom-up deposition of microvias under the synergistic effect of the microvia filling performance reached 96.9%. These results demonstrated that 1d could serve as a promising leveler for microvia filling and provide theoretical guidance to the discovery and synthesis of novel levelers.