文献类型：期刊文献

英文题名：Interface adhesion enhancement by condensed aromatic ring expansion of naphthalene imide derivatives for microvia metallization by copper electroplating

作者：Lv, Jinge[1];Xu, Jie[1];Zhao, Xuehua[1];Han, Jianwei[1];Chen, Biao[1];Wang, Xiaomin[1];He, Yulong[1];Li, Jun[1];Wang, Limin[1]

机构：[1]East China Univ Sci & Technol, Sch Chem & Mol Engn, Shanghai Key Lab Funct Mat Chem, 130 Meilong Rd, Shanghai 200237, Peoples R China

年份：2021

卷号：727

外文期刊名：THIN SOLID FILMS

收录：;EI(收录号：20211710268595);WOS:【SCI-EXPANDED(收录号:WOS:000645443100002)】；

基金：This research was financially supported by the National Natural Science Foundation of China (21272069, 21772039) and the Fundamental Research Funds for the Central Universities and Key Laboratory of Organofluorine Chemistry, Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences. We wish to confirm that there are no known conflicts of interest associated with this publication.

语种：英文

外文关键词：Naphthalene imide; Condensed aromatic rings; Microvia; Leveler; Electrodeposition

摘要：Copper electrodeposition is the preferred approach to fabricate the metallic part of printed circuit board (PCB). However, super-filling of the highly variable topography requires chemical additives, particularly leveler. Herein, three water-soluble naphthalene imide derivatives (NPI) were rationally synthesized and applied as levelers for microvias electrodeposition. Due to the expansion of aromatic ring of naphthalene, the adhesion of NPI to copper surface is improved. Comprehensive electrochemical measurements and microvia deposition experiments demonstrate that the adhesion enhancement of the leveler brings about better filling performance. Theoretical calculations unveiled that the variations of the condensed aromatic ring is the main reason for the change of the bandgap and of the adsorption energy of NPI toward the copper surface. Upon using the heptacyclic NPI (1c) as leveler, a thin copper film with thickness of the order of nanometer was achieved, which is of considerable importance for the building-up high-density-interconnected PCB. Finally, potentiodynamic polarization and secondary ion mass spectrometry measurements were used to investigate the consumption and incorporation of NPI 1c into the copper film upon the deposition process, in order to optimally parametrize the usage of NPI 1c during the copper electrodeposition process.