文献类型：期刊文献

英文题名：All Digital Light Processing-3D Printing of Flexible Sensor

作者：Xiao, Ting[1];Chen, Yang[1];Li, Qi[1];Gao, Yang[1];Pan, Likun[2];Xuan, Fuzhen[1]

机构：[1]East China Univ Sci & Technol, Sch Mech & Power Engn, Shanghai Key Lab Intelligent Sensing & Detect Tec, Shanghai 200237, Peoples R China;[2]East China Normal Univ, Sch Phys & Elect Sci, Shanghai 200241, Peoples R China

年份：2023

卷号：8

期号：2

外文期刊名：ADVANCED MATERIALS TECHNOLOGIES

收录：;EI(收录号：20224713135601);WOS:【SCI-EXPANDED(收录号:WOS:000881757600001)】；

基金：This work was supported by the National Natural Science Foundation of China (Grant Nos. 52275146, 51835003, 61804054, and 12174102).

语种：英文

外文关键词：3D printing; carbon nanotube; flexible sensor; silver nanowires

摘要：Flexible sensor with high sensitivity, high durability, and facile fabrication process has promising applications in structural health monitoring, human-machine interface, and soft robotics areas. Digital light processing-3D (DLP-3D) printing can print flexible sensor in a scalable process. However, to achieve all DLP-3D printing of flexible sensor, there still exist challenges of how to print sensing units with high sensitivity to external stimuli, interconnectors with high conductive stability at deformations, and robust interfaces between them for long-term usage. To address this, a hybrid DLP-3D printing method is developed, including the key steps of printing carbon nanotube/elastomer (MWCNT/EA) as sensing units and selective electrostatic self-assembly of silver nanowires (Ag NWs) as interconnectors. As a demonstration, a flexible pressure sensor array integrated with amplifier circuit is fabricated by the method. The MWCNT/EA sensing unit with woodpile structure has nine times improved sensitivity than the solid one. The Ag NW interconnector with serpentine configuration shows insensitivity to strain and good mechanical stability. The interface between sensing unit and interconnector is mechanical robust due to the chemical bond formation under ultraviolet radiation. The flexible sensor could detect external stimuli with enhanced signals enabled by integrated amplifier circuit, exhibiting potentials of the method for flexible electronic fabrication.